2026-09-18T23:39:29Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/329392022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131024
Alexander H. Slocum.
Jonnalagadda, Aparna S
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2006-05-15T20:40:38Z
2006-05-15T20:40:38Z
2005
2005
http://hdl.handle.net/1721.1/32939
62783565
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005.
Includes bibliographical references (leaf 44).
Equipment and procedures were developed to test two passive microfluidic interconnect rings held together by the friction forces on the contact surfaces. The second design forms fluid seals by means of thin flared rings of compliant material being compressed into undersized sockets. Interconnects were tested in pairs and arrays. The sealing performance of the first design was found to be highly dependent on the material and surface finish of the features, and the design was found to be largely intolerant to the misalignment inherent in arrays. The second design successfully seals up to 150 psi and is capable of compensating for misalignment to seal in arrays of six interconnects.
by Aparna S. Jonnalagadda.
S.B.
48 leaves
2840607 bytes
2841108 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Passive microfluidic interconnects
Thesis
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