2026-09-19T20:41:20Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/343532022-01-13T07:54:29Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
L. Rafael Reif and Robert K. Reich.
Tyrrell, Brian (Brian Matthew)
Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
2006-11-06T18:17:02Z
2006-11-06T18:17:02Z
2004
2004
http://hdl.handle.net/1721.1/34353
70078282
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2004.
Includes bibliographical references (p. 153-159).
Three dimensional integration schemes for VLSI have the potential for enabling the development of new high-performance architectures for applications such as focal plane sensors. Due to the high costs involved in 3-D VLSI fabrication and the fabrication complexity of 3-D integration, analysis of the design and process tradeoffs for a particular application is essential. An architectural and topological design tool is presented that enables the high-level analysis and optimization of sensor architectures targeted to a variety of 3-D VLSI process options. This design tool is based on an inference chain evaluation framework, and allows for a high-level structural representation of a circuit architecture to be considered in conjunction with low-level process models. Approximation strategies for projecting circuit area and performance are incorporated into the inference chain relations.
by Brian Tyrrell.
S.M.
159 p.
8060895 bytes
8068367 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Electrical Engineering and Computer Science.
Development of an architectural design tool for 3-D VLSI sensors
Thesis
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