2026-09-19T21:53:07Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/346792022-01-13T07:54:29Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
David J. Perreault.
Cantillon-Murphy, Pádraig J
Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.
Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
2006-11-07T17:18:42Z
2006-11-07T17:18:42Z
2005
2005
http://hdl.handle.net/1721.1/34679
67617792
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2005.
Includes bibliographical references (leaves 85-88).
As component and power densities have increased, printed circuit boards (PCBs) have taken on additional functionality including heatsinking and forming constituent parts of electrical components. PCBs are not well suited to these tasks. A novel fabrication method is proposed to develop an enhanced circuit board fabrication approach which overcomes this problem. This method uses a photoresistive scaffold and subsequent metallization to realize the proposed structures. These structures are suitable as heatsinks, inductor windings, busbars and EMI shields among other applications.
by Pádraig J. Cantillon-Murphy.
S.M.
88 leaves
3793176 bytes
3796792 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Electrical Engineering and Computer Science.
Development of three-dimensional passive components for power electronics
Development of 3D passive components for power electronics
Thesis
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