<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-18T21:23:04Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/35651" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/35651</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">David E. Hardt.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Wang, Qi, S.M. Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2007-01-10T16:56:26Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2007-01-10T16:56:26Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2006</dim:field>
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   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">76761424</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2006.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">"June 2006."</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">The micro embossing process on polymethylmethacrylate (PMMA) is demonstrated experimentally to be a useful process to produce micro fluidic and optical devices. Because this process is a one step thermoplastic deformation process, it is possible to reach high production rates and low cost in manufacturing compared to the standard clean room processes. Currently, the research about this process is still on the feasibility level, with not a quantitative work to optimize the process parameters and assure product quality. In this thesis, an experimental study on process window and variation of Micro Embossing is presented. This study includes the design and manufacturing of an embossing die, the development of an embossing product quality assessment protocol, the process window characterization and the process variation identification. The research results based on the experimental set up in this thesis show that we should apply constant 800N embossing force at an embossing velocity of 1000N/min in order to obtain well formed parts to maintain low process cycle time.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">(cont.) An embossing temperature of 120°C and de-embossing temperature of 55°C are shown to be the optimal embossing condition to yield good replication and repeatability. These embossing parameters operating window can change with the variation of working piece material, die material and die design.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Qi Wang.</dim:field>
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   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
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   <dim:field mdschema="dc" element="rights" qualifier="uri">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Process window and variation characterization of the micro embossing process</dim:field>
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   	&lt;Title>Process window and variation characterization of the micro embossing process&lt;/Title>
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   	&lt;PublicationDate>2006&lt;/PublicationDate>
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        	&lt;DisplayName>Wang, Qi, S.M. Massachusetts Institute of Technology&lt;/DisplayName>
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   	&lt;Abstract>The micro embossing process on polymethylmethacrylate (PMMA) is demonstrated experimentally to be a useful process to produce micro fluidic and optical devices. Because this process is a one step thermoplastic deformation process, it is possible to reach high production rates and low cost in manufacturing compared to the standard clean room processes. Currently, the research about this process is still on the feasibility level, with not a quantitative work to optimize the process parameters and assure product quality. In this thesis, an experimental study on process window and variation of Micro Embossing is presented. This study includes the design and manufacturing of an embossing die, the development of an embossing product quality assessment protocol, the process window characterization and the process variation identification. The research results based on the experimental set up in this thesis show that we should apply constant 800N embossing force at an embossing velocity of 1000N/min in order to obtain well formed parts to maintain low process cycle time.&lt;/Abstract>
   	&lt;Abstract>(cont.) An embossing temperature of 120°C and de-embossing temperature of 55°C are shown to be the optimal embossing condition to yield good replication and repeatability. These embossing parameters operating window can change with the variation of working piece material, die material and die design.&lt;/Abstract>
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