2026-09-19T17:45:58Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/367012022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131024
Jung-Hoon Chun and Nannaji Saka.
Shieh, Marvin Bryan
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2007-03-12T17:45:46Z
2007-03-12T17:45:46Z
2006
2006
http://hdl.handle.net/1721.1/36701
77549974
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2006.
Includes bibliographical references (leaf 27).
A working prototype face-up CMP tool has successfully been completed. Experiments conducted on the face-up CMP machine qualitatively correspond with the theoretical polishing model. Discrepancies in data from the theoretical model could potentially be caused by non-uniform loading of the polishing pad and uneven distribution of slurry over the pad due to the edge effects on fluid flow. Despite the discrepancies, experimental data suggest that the theoretical model used to describe blanket wafer polishing by the face-up CMP tool is at least partially valid.
by Marvin Bryan Shieh.
S.B.
27 leaves
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Face-up chemical mechanical polishing : kinematics and material removal rate
Face-up CMP : kinematics and material removal rate
Thesis
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