2026-09-19T16:01:05Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/373732022-01-13T07:54:33Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Carl V. Thompson.
Anwar Ali, Hashina Parveen
Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Massachusetts Institute of Technology. Department of Materials Science and Engineering
2007-05-16T18:26:36Z
2007-05-16T18:26:36Z
2006
2006
http://hdl.handle.net/1721.1/37373
104699663
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2006.
Includes bibliographical references (leaves 93-94).
Carbon nanotubes (CNTs) have been investigated as candidate materials to replace or augment the existing copper-based technologies as interconnects for Integrated Circuit (IC) chips. Being ballistic conductors, CNTs are capable of carrying higher current densities of up to 10¹⁰A/cm² and high thermal conductivity. This thesis examines the technological aspect of carbon nanotubes - how these tubes can excel in place of copper in terms of their performance and integration into the current commercial IC chip process. A detailed literature review is covered, together with a performance analysis of the resistances between copper and CNT interconnects. Further, a business model is proposed on the possibility of introducing this technology into the mainstream IC industry.
by Hashina Parveen Anwar Ali.
M.Eng.
97 leaves
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Materials Science and Engineering.
Carbon nanotube interconnects for IC chips
CNT interconnects for Integrated Chip chips
Thesis
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