<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-18T23:40:19Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/38277" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/38277</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Alexander H. Slocum.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Thompson, Mary Kathryn, 1980-</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2007-08-03T18:24:54Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2007-08-03T18:24:54Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2004</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2004</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/38277</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">153274626</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2004.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">A reversible, Chip-to-Chip microfluidic interconnect was designed for use in high temperature, high pressure applications such as chemical microreactor systems. The interconnect uses two sets of concentric, interlocking rings with trapezoidal cross sections to form a fluid seal without the use of gaskets or sealants. Results from analytical and finite element models indicate good sealing capability. Macro scale devices show that the interconnects function as designed and seal up to 80 psi. Micro scale devices have been fabricated, engage as designed and are much stronger than anticipated, however pressure tests have not yet been conducted.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Mary Kathryn Thompson.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">94 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Reversible concentric ring microfluidic interconnects</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
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	&lt;Language>eng&lt;/Language>
   	&lt;Title>Reversible concentric ring microfluidic interconnects&lt;/Title>
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   	&lt;PublicationDate>2004&lt;/PublicationDate>
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        	&lt;DisplayName>Thompson, Mary Kathryn, 1980-&lt;/DisplayName>
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            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>A reversible, Chip-to-Chip microfluidic interconnect was designed for use in high temperature, high pressure applications such as chemical microreactor systems. The interconnect uses two sets of concentric, interlocking rings with trapezoidal cross sections to form a fluid seal without the use of gaskets or sealants. Results from analytical and finite element models indicate good sealing capability. Macro scale devices show that the interconnects function as designed and seal up to 80 psi. Micro scale devices have been fabricated, engage as designed and are much stronger than anticipated, however pressure tests have not yet been conducted.&lt;/Abstract>
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