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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Subra Suresh.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Guzek, John S. (John Stephen)</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1996.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 84-87).</dim:field>
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   <dim:field mdschema="dc" element="title" lang="en_US">Fatigue crack propagation along polymer-metal interfaces in microelectronic packages</dim:field>
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   	&lt;Title>Fatigue crack propagation along polymer-metal interfaces in microelectronic packages&lt;/Title>
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