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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Nicholas J. Grant.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Gabriel, Michelle Wendy</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">1983</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1983.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">MICROFICHE COPY AVAILABLE IN ARCHIVES AND SCIENCE</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Michelle Wendy Gabriel.</dim:field>
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   <dim:field mdschema="dc" element="subject" lang="en_US">Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Wettability of low Sn solders on integrated circuit package metallizations</dim:field>
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   	&lt;Title>Wettability of low Sn solders on integrated circuit package metallizations&lt;/Title>
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