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Lionel C. Kimerling. Lee, Chieh-feng Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. Massachusetts Institute of Technology. Department of Materials Science and Engineering 2008-09-03T14:44:45Z 2008-09-03T14:44:45Z 2007 2007 http://hdl.handle.net/1721.1/42155 228504483 Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2007. Includes bibliographical references. As the demand of information capacity grows, the adoption of optical technology will increase. The issue of resistance and capacitance is limiting the electronic transmission bandwidth while fiber optic delivers data at the speed of light and is only limited by scattering as well as absorption. Electronic-photonic convergence is needed for communication systems to meet the performance requirement. Hence, an increasing number of Very-Large-Scale Integration (VLSI) electronic photonic chips are going to be designed and utilized. However, packaging for the chip is one of the major challenges for optoelectronic industry to overcome due to its high cost and lack of standards. This thesis examines the trend in semiconductor technology and also in the package performance requirement. A transceiver platform to meet the future information capacity demand is proposed by reviewing several materials and devices of current state. Lastly, the package design is demonstrated with the analysis of cost, performance, and materials. by Chieh-feng Lee. M.Eng. 44 leaves eng Massachusetts Institute of Technology M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 Materials Science and Engineering. Packaging solution for VLSI electronic photonic chips Packaging solution for Very-Large-Scale-Integration electronic photonic chips Thesis application/pdf false Publication unknown unknown <Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="e0fd9d19-09d8-4fe1-92a9-dd828f0a53cf"> <Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type> <Language>eng</Language> <Title>Packaging solution for VLSI electronic photonic chips</Title> <Subtitle>Packaging solution for Very-Large-Scale-Integration electronic photonic chips</Subtitle> <PublishedIn> <Publication> </Publication> </PublishedIn> <PublicationDate>2007</PublicationDate> <Authors> <Author> <DisplayName>Lee, Chieh-feng</DisplayName> <Affiliation> <OrgUnit> </OrgUnit> </Affiliation> </Author> </Authors> <Editors> </Editors> <Publishers> <Publisher> <DisplayName>Massachusetts Institute of Technology</DisplayName> <OrgUnit /> </Publisher> </Publishers> <License>http://dspace.mit.edu/handle/1721.1/7582</License> <Keyword>Materials Science and Engineering.</Keyword> <Abstract>As the demand of information capacity grows, the adoption of optical technology will increase. The issue of resistance and capacitance is limiting the electronic transmission bandwidth while fiber optic delivers data at the speed of light and is only limited by scattering as well as absorption. Electronic-photonic convergence is needed for communication systems to meet the performance requirement. Hence, an increasing number of Very-Large-Scale Integration (VLSI) electronic photonic chips are going to be designed and utilized. However, packaging for the chip is one of the major challenges for optoelectronic industry to overcome due to its high cost and lack of standards. This thesis examines the trend in semiconductor technology and also in the package performance requirement. A transceiver platform to meet the future information capacity demand is proposed by reviewing several materials and devices of current state. Lastly, the package design is demonstrated with the analysis of cost, performance, and materials.</Abstract> <Access xmlns="http://purl.org/coar/access_right" > </Access> </Publication>