<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-21T17:33:42Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/42421" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/42421</identifier><datestamp>2022-01-13T07:54:29Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131022</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Peter L. Hagelstein.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Wu, Dennis M. (Dennis Meng-Jiao)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2008-09-03T15:36:46Z</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2007</dim:field>
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   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">238572886</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 236-242).</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, February 2008.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">A new thermal to electric conversion scheme based on an excitation transfer and tunneling mechanism is studied theoretically. Coulomb coupling dominates when the hot side and the cold side are very close. Two important concepts went into the device scheme: (1) Coulomb coupling, to try to increase throughput power (which is not subject to blackbody limit), and (2) a quantum dot implementation, to restrict number of states, to try to increase efficiency. Modeling efforts from Bloch equations, brute force numerical simulations, and the secular equations partitioning method are discussed. A hot-side quantum dot design of the device is considered. Alternative implementation where the hot-side is a plain sheet of metal or aluminum oxide is analyzed. We found that the model power/area is higher than the blackbody limit, and the predicted conversion efficiency is very high.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Dennis M. Wu.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">Ph.D.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">242 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
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   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Quantum-coupled single-electron thermal to electric conversion scheme</dim:field>
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   	&lt;Title>Quantum-coupled single-electron thermal to electric conversion scheme&lt;/Title>
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   	&lt;PublicationDate>2008&lt;/PublicationDate>
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        	&lt;DisplayName>Wu, Dennis M. (Dennis Meng-Jiao)&lt;/DisplayName>
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   	&lt;Abstract>A new thermal to electric conversion scheme based on an excitation transfer and tunneling mechanism is studied theoretically. Coulomb coupling dominates when the hot side and the cold side are very close. Two important concepts went into the device scheme: (1) Coulomb coupling, to try to increase throughput power (which is not subject to blackbody limit), and (2) a quantum dot implementation, to restrict number of states, to try to increase efficiency. Modeling efforts from Bloch equations, brute force numerical simulations, and the secular equations partitioning method are discussed. A hot-side quantum dot design of the device is considered. Alternative implementation where the hot-side is a plain sheet of metal or aluminum oxide is analyzed. We found that the model power/area is higher than the blackbody limit, and the predicted conversion efficiency is very high.&lt;/Abstract>
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