<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-20T01:32:39Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/45361" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/45361</identifier><datestamp>2022-01-13T07:54:33Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Eugene A. Fitzgerald.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Liang, Yu Yan</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Materials Science and Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2009-04-29T17:30:41Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2009-04-29T17:30:41Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2008</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2008</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/45361</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">316803479</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (leaf 40).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">The commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Yu Yan Liang.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">74 leaves</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
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   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Materials Science and Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Commercialization of silicon on lattice-engineered substrate for electronic applications</dim:field>
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   	&lt;Title>Commercialization of silicon on lattice-engineered substrate for electronic applications&lt;/Title>
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   	&lt;PublicationDate>2008&lt;/PublicationDate>
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        	&lt;DisplayName>Liang, Yu Yan&lt;/DisplayName>
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    &lt;Keyword>Materials Science and Engineering.&lt;/Keyword>
   	&lt;Abstract>The commercial potential of SOLES (Silicon on Lattice-Engineered Substrate) is investigated considering the competing technologies, competing market players and market demands. Monolithic integration of Si devices with III-V electronic devices using SOLES could be used to produce single chip wireless IC, catering the need of the most prosperous consumer markets, the mobile phone market and the WLAN/WMAN/WWAN wireless connectivity market. A cost model has been developed to justify the cost effectiveness of single chip wireless IC. The commercial viability of SOLES is commented based on these analyses.&lt;/Abstract>
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