2026-09-19T21:54:26Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/453892022-01-13T07:54:33Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Carl V. Thompson II and Chee Lip Gan.
Nagarajan, Raghavan
Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Massachusetts Institute of Technology. Department of Materials Science and Engineering
2009-04-29T17:34:30Z
2009-04-29T17:34:30Z
2008
2008
http://hdl.handle.net/1721.1/45389
317401219
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2008.
Includes bibliographical references (p. 84-87).
Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power dissipation, along with an improved form factor and portability. One of the most recent novel and promising wafer bonding approaches to realizing 3DIC is Low Temperature Thermocompression (LTTC) bonding using copper (Cu) as the bonding interface material. This thesis investigates the LTTC bonding approach in terms of its technological implications in contrast to other conventional bonding approaches. The various technological aspects pertaining to LTTC are comprehensively explored and analyzed. In addition to this, the commercialization potential for this technology is also studied and the economic viability of this process in production is critically evaluated using suitable cost models. Based on the technological and economic outlook, the potential for commercialization of LTTC is gauged.
by Raghavan Nagarajan.
M.Eng.
87 p.
eng
Massachusetts Institute of Technology
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http://dspace.mit.edu/handle/1721.1/7582
Materials Science and Engineering.
Commercialization of low temperature copper thermocompression bonding for 3D integrated circuits
Thesis
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<Abstract>Wafer bonding is a key process and enabling technology for realization of three-dimensional integrated circuits (3DIC) with reduced interconnect delay and correspondingly increased circuit speed and decreased power dissipation, along with an improved form factor and portability. One of the most recent novel and promising wafer bonding approaches to realizing 3DIC is Low Temperature Thermocompression (LTTC) bonding using copper (Cu) as the bonding interface material. This thesis investigates the LTTC bonding approach in terms of its technological implications in contrast to other conventional bonding approaches. The various technological aspects pertaining to LTTC are comprehensively explored and analyzed. In addition to this, the commercialization potential for this technology is also studied and the economic viability of this process in production is critically evaluated using suitable cost models. Based on the technological and economic outlook, the potential for commercialization of LTTC is gauged.</Abstract>
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