<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-18T22:32:35Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/46488" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/46488</identifier><datestamp>2022-01-13T07:54:29Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Yoel Fink.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Spencer, Matthew Edmund</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2009-08-26T16:34:00Z</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2008</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2008</dim:field>
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   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">400004667</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2008.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 67).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Recent developments in materials science have led to the development of an exciting, new class of fibers which integrate metals, semiconductors and insulators in the same codrawing process. Various electrical devices have been produced in these fibers including optical sensors, thermal sensors and even transistors. The use of these fiber devices in a variety of applications was explored. A large-scale, lensless imager, an optical communication system, a thermal sensing array and a logic gate were designed to use appropriate classes of electrically active fibers. These devices were constructed with a particular focus on testing the best ways to integrate these fibers with modern circuits. Several methods of making electrical contact with fibers are described and their failure modes are discussed and novel circuits for amplifying and measuring fiber signals are developed and presented.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Matthew Edmund Spencer.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">67 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
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permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Optoelectronic fiber interface design</dim:field>
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   	&lt;Title>Optoelectronic fiber interface design&lt;/Title>
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   	&lt;PublicationDate>2008&lt;/PublicationDate>
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    &lt;Keyword>Electrical Engineering and Computer Science.&lt;/Keyword>
   	&lt;Abstract>Recent developments in materials science have led to the development of an exciting, new class of fibers which integrate metals, semiconductors and insulators in the same codrawing process. Various electrical devices have been produced in these fibers including optical sensors, thermal sensors and even transistors. The use of these fiber devices in a variety of applications was explored. A large-scale, lensless imager, an optical communication system, a thermal sensing array and a logic gate were designed to use appropriate classes of electrically active fibers. These devices were constructed with a particular focus on testing the best ways to integrate these fibers with modern circuits. Several methods of making electrical contact with fibers are described and their failure modes are discussed and novel circuits for amplifying and measuring fiber signals are developed and presented.&lt;/Abstract>
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