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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Duane Boning and James Chung.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Park, Tae Hong, 1973-</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">1998</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">1998</dim:field>
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   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">40458672</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science; and, Thesis (B.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1998.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (leaves 73-75).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Tae Hong Park.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">B.S.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">75 leaves</dim:field>
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   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
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   <dim:field mdschema="dc" element="title" lang="en_US">Framework for characterization of copper interconnect in damascene CMP processes</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">Characterization and modeling of pattern dependent variation in copper damascene CMP processes</dim:field>
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   	&lt;Title>Framework for characterization of copper interconnect in damascene CMP processes&lt;/Title>
   	&lt;Subtitle>Characterization and modeling of pattern dependent variation in copper damascene CMP processes&lt;/Subtitle>
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   	&lt;PublicationDate>1998&lt;/PublicationDate>
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