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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Roy Welsch and Frederic McGarry.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Clough, Sherry L. (Sherry Lynn), 1969-</dim:field>
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   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M.S.)--Massachusetts Institute of Technology, Sloan School of Management; and, Thesis (M.S.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 109-110).</dim:field>
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   <dim:field mdschema="dc" element="title" lang="en_US">Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability</dim:field>
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   	&lt;Title>Flip chip attachment methods : a methodology for evaluating the effects of supplier process variation and supplier relationships on product reliability&lt;/Title>
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