2026-09-20T11:16:10Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/504542021-07-05T14:03:20Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
David K. Roylance.
Chiang, Diana C. (Diana Chih-Chan), 1975-
Massachusetts Institute of Technology. Department of Materials Science and Engineering
2010-01-07T20:41:16Z
2010-01-07T20:41:16Z
1998
1998
http://hdl.handle.net/1721.1/50454
42075763
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
Includes bibliographical references (leaf 34).
Six underfill materials were examined for the selection of an appropriate underfill material for Digital Equipment Corporation's flip chip development project. Several tests were performed to determine the material properties, process properties, and the reliability of each underfill material. A material with a fast flow rate, uniform and void free flow pattern, fast curing schedule, good thermal and mechanical properties, and good reliability results is needed to satisfy the requirements for this project. Materials F and E exhibited all the above requirements and were concluded as the two best underfill materials for the flip chip process. Important material properties which contributed to the desired results of these materials include a filler particle content of about 65%, a weight loss percentage during cure of less than 1%, and a Tg of 140°C.
by Diana C. Chiang.
S.M.
34 leaves
eng
Massachusetts Institute of Technology
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http://dspace.mit.edu/handle/1721.1/7582
Materials Science and Engineering
Underfill material selection for flip chip technology
Thesis
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