<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T13:41:39Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/54524" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/54524</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131024</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Gang Chen.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Phillips, Samuel S</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2010-04-28T16:56:28Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2010-04-28T16:56:28Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2009</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/54524</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">560664372</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">"June 2009." Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 22).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">An experimental setup was designed and utilized to measure the thermoelectric properties as functions of temperature of a commercially available, bismuth telluride thermoelectric module. Thermoelectric modules are solid state semiconducting devices that act reversibly as both a heat pump and a power generator. The experimental setup encased the modules in an insulating container and thermal power was provided by a variable power cartridge heater, using type-K thermocouples to measure the temperature difference across the module. The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Samuel S. Phillips.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.B.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">22 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Characterizing the thermal efficiency of thermoelectric modules</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
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	&lt;Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843&lt;/Type>
	&lt;Language>eng&lt;/Language>
   	&lt;Title>Characterizing the thermal efficiency of thermoelectric modules&lt;/Title>
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      	&lt;/Publication>
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   	&lt;PublicationDate>2009&lt;/PublicationDate>
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        	&lt;DisplayName>Phillips, Samuel S&lt;/DisplayName>
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            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
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    &lt;License>http://dspace.mit.edu/handle/1721.1/7582&lt;/License>
    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>An experimental setup was designed and utilized to measure the thermoelectric properties as functions of temperature of a commercially available, bismuth telluride thermoelectric module. Thermoelectric modules are solid state semiconducting devices that act reversibly as both a heat pump and a power generator. The experimental setup encased the modules in an insulating container and thermal power was provided by a variable power cartridge heater, using type-K thermocouples to measure the temperature difference across the module. The measured parameters were compared against published data on a similar type of module. The thermal conductivity was measured within 21% of the accepted value on average, the Seebeck coefficient within 16%, the figure of merit within a factor two, and the thermal efficiency within 20% for low [delta]T of less than 25°C.&lt;/Abstract>
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