2026-09-19T15:20:16Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/545432022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131024
Jung-Hoon Chun.
De Castro, Eloisa M
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2010-04-28T16:58:57Z
2010-04-28T16:58:57Z
2009
2009
http://hdl.handle.net/1721.1/54543
566065522
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2009.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 21).
The advent of legislation restricting the use of lead in electronics requires innovation and refinement in processes for creating lead-free solder spheres for wafer bumping and other surface mount technology. Operation improvements were made upon a uniform droplet spray apparatus, and its digital integral controller was tuned for application to lead-free solder. Parameters determined included a range of initial controller command frequencies that would produce a stable image given a desired droplet diameter, and the value of the controller gain. The frequency range was determined by measuring the diameters of droplets attained at certain frequencies. The controller gain was optimized by measuring the time it took for the controller to reach its steady state at different gain values. It was determined that initial command frequency should be within ±150 Hz of that corresponding to the target diameter and an integral gain of 0.1 dB is the optimal gain for the tin-copper lead-free solder alloy, performing at par with the system specifications when in use with lead-bearing solder.
by Eloisa M. de Castro.
S.B.
21 p.
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Tuning and parameter optimization of a digital integral controller for uniform droplet spray applications using lead-free tin-copper solder
Thesis
application/pdf
Publication
unknown
unknown
<Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="2d6aaa74-4a87-48be-b411-e01c5e061520">
<Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type>
<Language>eng</Language>
<Title>Tuning and parameter optimization of a digital integral controller for uniform droplet spray applications using lead-free tin-copper solder</Title>
<PublishedIn>
<Publication>
</Publication>
</PublishedIn>
<PublicationDate>2009</PublicationDate>
<Authors>
<Author>
<DisplayName>De Castro, Eloisa M</DisplayName>
<Affiliation>
<OrgUnit>
</OrgUnit>
</Affiliation>
</Author>
</Authors>
<Editors>
</Editors>
<Publishers>
<Publisher>
<DisplayName>Massachusetts Institute of Technology</DisplayName>
<OrgUnit />
</Publisher>
</Publishers>
<License>http://dspace.mit.edu/handle/1721.1/7582</License>
<Keyword>Mechanical Engineering.</Keyword>
<Abstract>The advent of legislation restricting the use of lead in electronics requires innovation and refinement in processes for creating lead-free solder spheres for wafer bumping and other surface mount technology. Operation improvements were made upon a uniform droplet spray apparatus, and its digital integral controller was tuned for application to lead-free solder. Parameters determined included a range of initial controller command frequencies that would produce a stable image given a desired droplet diameter, and the value of the controller gain. The frequency range was determined by measuring the diameters of droplets attained at certain frequencies. The controller gain was optimized by measuring the time it took for the controller to reach its steady state at different gain values. It was determined that initial command frequency should be within ±150 Hz of that corresponding to the target diameter and an integral gain of 0.1 dB is the optimal gain for the tin-copper lead-free solder alloy, performing at par with the system specifications when in use with lead-bearing solder.</Abstract>
<Access xmlns="http://purl.org/coar/access_right"
>
</Access>
</Publication>