<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T10:44:35Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/59175" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/59175</identifier><datestamp>2022-01-27T21:53:00Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Daniel Whitney and Sara Beckman.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Sailer, Chad (Chad Darren)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Leaders for Global Operations Program.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department" lang="en_US">Leaders for Global Operations Program at MIT</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Sloan School of Management</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2010-10-12T18:01:54Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2010-10-12T18:01:54Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2010</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2010</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/59175</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">659780941</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering; in conjunction with the Leaders for Global Operations Program at MIT, 2010.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 89-91).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Intel Corporation is the world's leading manufacturer of processors for personal computers. As the company strives to maintain its leadership position in this industry, it identifies significant trends in the industry and attempts to develop product solutions that intercept these trends. One such set of industry vectors is the continued movement toward lower cost and smaller notebook system designs with a coincident shift toward fully outsourced production in China. These trends point to increased future demand for processors utilizing a ball-grid-array (BGA) package in notebook computers, which is the lower cost, smaller size packaging technology available today. This project was initiated to understand why with such a seemingly favorable environment for BGA, it still represents a small minority of Intel's mobile processor volume. The analysis shows that significant changes must be made to Intel's product roadmap, OEM product scalability strategies, or after-sale service models to enable a full transition to BGA processors. SKU levels increase by lOx with a BGA transition resulting in much higher supply chain complexity, management cost, and inventory cost. In addition, simple modeling approaches are developed and utilized for this study that can be leveraged in the future to quantify possible product strategy impacts on the industry supply chain. They can also be used in other industries contemplating supply chain simplification strategies.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Chad Sailer.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.B.A.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">91 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by &#xd;
copyright. They may be viewed from this source for any purpose, but &#xd;
reproduction or distribution in any format is prohibited without written &#xd;
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Sloan School of Management.</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Leaders for Global Operations Program.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Impact of product design choices on supply chain performance in the notebook computer industry</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="mimetype">application/pdf</dim:field>
   <dim:field mdschema="dspace" element="authorsordered">false</dim:field>
   <dim:field mdschema="dspace" element="entity" qualifier="type">Publication</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="others" element="access-status">unknown</dim:field>
   <dim:field mdschema="cerif" element="openaire" authority="" confidence="-1">&lt;Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="3bdce7d6-e52c-4f8e-8f72-60d0a660fe2c">
	&lt;Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843&lt;/Type>
	&lt;Language>eng&lt;/Language>
   	&lt;Title>Impact of product design choices on supply chain performance in the notebook computer industry&lt;/Title>
   	&lt;PublishedIn>
    	&lt;Publication>
      	&lt;/Publication>
   	&lt;/PublishedIn>
   	&lt;PublicationDate>2010&lt;/PublicationDate>
   	&lt;Authors&gt;
      	&lt;Author>
        	&lt;DisplayName>Sailer, Chad (Chad Darren)&lt;/DisplayName>
         	&lt;Affiliation>
         		&lt;OrgUnit>
         		&lt;/OrgUnit>
         	&lt;/Affiliation>
      	&lt;/Author>
	&lt;/Authors>
   	&lt;Editors>
	&lt;/Editors>
    &lt;Publishers>
        &lt;Publisher>
            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
            &lt;OrgUnit />
        &lt;/Publisher>
    &lt;/Publishers>
    &lt;License>http://dspace.mit.edu/handle/1721.1/7582&lt;/License>
    &lt;Keyword>Sloan School of Management.&lt;/Keyword>
    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
    &lt;Keyword>Leaders for Global Operations Program.&lt;/Keyword>
   	&lt;Abstract>Intel Corporation is the world&amp;apos;s leading manufacturer of processors for personal computers. As the company strives to maintain its leadership position in this industry, it identifies significant trends in the industry and attempts to develop product solutions that intercept these trends. One such set of industry vectors is the continued movement toward lower cost and smaller notebook system designs with a coincident shift toward fully outsourced production in China. These trends point to increased future demand for processors utilizing a ball-grid-array (BGA) package in notebook computers, which is the lower cost, smaller size packaging technology available today. This project was initiated to understand why with such a seemingly favorable environment for BGA, it still represents a small minority of Intel&amp;apos;s mobile processor volume. The analysis shows that significant changes must be made to Intel&amp;apos;s product roadmap, OEM product scalability strategies, or after-sale service models to enable a full transition to BGA processors. SKU levels increase by lOx with a BGA transition resulting in much higher supply chain complexity, management cost, and inventory cost. In addition, simple modeling approaches are developed and utilized for this study that can be leveraged in the future to quantify possible product strategy impacts on the industry supply chain. They can also be used in other industries contemplating supply chain simplification strategies.&lt;/Abstract>
	&lt;Access xmlns="http://purl.org/coar/access_right" 
    >
    &lt;/Access>
&lt;/Publication>
</dim:field>
</dim:dim>
</metadata></record></GetRecord></OAI-PMH>