<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-20T10:21:04Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/62508" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/62508</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">David E. Hardt.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Sun, Yulei</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2011-04-25T16:10:43Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2011-04-25T16:10:43Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2010</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2010</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/62508</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">712601868</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 101-103).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">This thesis focuses on the operational improvements in a semiconductor equipment manufacturing company (Varian Semiconductor Equipment Associates). The company faces challenges of highly fluctuating demand as well as complex and highly customized assembly, which lead to problems such as lead time control and components tracking at multiple manufacturing stages. The goal of the project is to propose an efficient assembly system with the ability of parts checking and tracking. Radio Frequency Identity (RFID) technology is introduced as the core method to treat the problems, in such a way that RFID tagged parts can be sensed automatically by antennas and identified by the system. In order to implement the system and maximize the benefits, redesign of the manufacturing process is proposed and discussed as the main results of this thesis. To achieve the goal, the current operations are carefully captured and analyzed; the RFID technology is briefly described as the basis of designing new procedures; the lean principles are introduced to refine the processes; and the simulation is applied to evaluate the changes between the old system and the new system. The solutions include three phases: 1) RFID for miscellaneous parts checking, 2) RFID for module parts tracking, 3) RFID for parts tracking in the flow line, respectively corresponding to the three problems: 1) Inefficient operation of miscellaneous parts, 2) fraudulent claims and warranty costs, and 3) deficient tracking ability. The analysis of benefits and the simulation results suggests a potential reduction of costs. A new material flow map and new procedures of certain stages are proposed. Finally, the two pilots are developed as stepping stones to formal implementation of the RFID system in VSEA.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Yulei Sun.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">107 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Implementation of RFID in a low volume high flexibility assembly plant : process redesign</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">Implementation of Radio-Frequency Identification in a low volume high flexibility assembly plant : process redesign</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">Internal supply chain redesign for RFID application</dim:field>
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   	&lt;Title>Implementation of RFID in a low volume high flexibility assembly plant : process redesign&lt;/Title>
   	&lt;Subtitle>Implementation of Radio-Frequency Identification in a low volume high flexibility assembly plant : process redesign&lt;/Subtitle&gt;
   	&lt;Subtitle>Internal supply chain redesign for RFID application&lt;/Subtitle>
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   	&lt;PublicationDate>2010&lt;/PublicationDate>
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        	&lt;DisplayName>Sun, Yulei&lt;/DisplayName>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>This thesis focuses on the operational improvements in a semiconductor equipment manufacturing company (Varian Semiconductor Equipment Associates). The company faces challenges of highly fluctuating demand as well as complex and highly customized assembly, which lead to problems such as lead time control and components tracking at multiple manufacturing stages. The goal of the project is to propose an efficient assembly system with the ability of parts checking and tracking. Radio Frequency Identity (RFID) technology is introduced as the core method to treat the problems, in such a way that RFID tagged parts can be sensed automatically by antennas and identified by the system. In order to implement the system and maximize the benefits, redesign of the manufacturing process is proposed and discussed as the main results of this thesis. To achieve the goal, the current operations are carefully captured and analyzed; the RFID technology is briefly described as the basis of designing new procedures; the lean principles are introduced to refine the processes; and the simulation is applied to evaluate the changes between the old system and the new system. The solutions include three phases: 1) RFID for miscellaneous parts checking, 2) RFID for module parts tracking, 3) RFID for parts tracking in the flow line, respectively corresponding to the three problems: 1) Inefficient operation of miscellaneous parts, 2) fraudulent claims and warranty costs, and 3) deficient tracking ability. The analysis of benefits and the simulation results suggests a potential reduction of costs. A new material flow map and new procedures of certain stages are proposed. Finally, the two pilots are developed as stepping stones to formal implementation of the RFID system in VSEA.&lt;/Abstract>
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