<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T18:41:31Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/64600" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/64600</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Taofang Zeng and Gang Chen.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Zuo, Yanjia</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2011-06-20T15:58:20Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2011-06-20T15:58:20Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2010</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2010</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/64600</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">727067791</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2010.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 90-96).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Reported silica aerogels have a thermal conductivity as low as 15 mW/mK. The fragility of silica aerogels, however, makes them impractical for structural applications. The purpose of the study is to improve the ductility of aerogels while retain the low thermal conductivity of silica aerogels. We have established a new synthesis route, a 3-step sol-gel processing method. The method provides better control of the formation of aerogel structures. The produced silica aerogels show much improved ductility compared to conventional methods in literatures. Furthermore, the synthesized silica aerogels have thermal conductivities as low as about 9 mW/mK, which is the lowest in all reported solids. The ultra low thermal conductivity can be explained with nano-scale structures for the silica aerogels, which have been characterized using advanced techniques including BET and SEM. We have further investigated and demonstrated the ability of enhancing mechanical properties of silica aerogels through structure modification using the proposed 3-step sol-gel processing method. The molecular-level synergism between silica particles/clusters and the doped functional materials inverts the relative host-guest roles in the produced aerogel composite, leading to new stronger and more robust low-density materials.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Yanjia Zuo.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">96 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Preparation of silica aerogels with improved mechanical properties and extremely low thermal conductivities through modified sol-gel process</dim:field>
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   	&lt;Title>Preparation of silica aerogels with improved mechanical properties and extremely low thermal conductivities through modified sol-gel process&lt;/Title>
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   	&lt;PublicationDate>2010&lt;/PublicationDate>
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        	&lt;DisplayName>Zuo, Yanjia&lt;/DisplayName>
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            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
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    &lt;Keyword&gt;Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>Reported silica aerogels have a thermal conductivity as low as 15 mW/mK. The fragility of silica aerogels, however, makes them impractical for structural applications. The purpose of the study is to improve the ductility of aerogels while retain the low thermal conductivity of silica aerogels. We have established a new synthesis route, a 3-step sol-gel processing method. The method provides better control of the formation of aerogel structures. The produced silica aerogels show much improved ductility compared to conventional methods in literatures. Furthermore, the synthesized silica aerogels have thermal conductivities as low as about 9 mW/mK, which is the lowest in all reported solids. The ultra low thermal conductivity can be explained with nano-scale structures for the silica aerogels, which have been characterized using advanced techniques including BET and SEM. We have further investigated and demonstrated the ability of enhancing mechanical properties of silica aerogels through structure modification using the proposed 3-step sol-gel processing method. The molecular-level synergism between silica particles/clusters and the doped functional materials inverts the relative host-guest roles in the produced aerogel composite, leading to new stronger and more robust low-density materials.&lt;/Abstract>
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