<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-21T17:27:27Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/67622" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/67622</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">David E. Hardt.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Lustrino, Michelle E. (Michelle Elizabeth)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2011-12-09T21:35:01Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2011-12-09T21:35:01Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2011</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2011</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/67622</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">765960391</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 145-149).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">The field of microfluidics has powerful applications in low-cost healthcare diagnostics, DNA analysis, and fuel cells, among others. As the field moves towards commercialization, the ability to robustly manufacture these devices at low cost is becoming more important. One of the many challenges in microfluidic manufacturing is the reliable sealing of the microfluidic chips once the channels have been generated. This work was an investigation of innovative ways to robustly heat the substrate-cover plate interface of a microfluidic device for the purpose of bonding and sealing the microfluidic channels. An extensive literature review revealed the benefits of interfacial heating, and both simulations and experimental investigations were used to evaluate a few different methods. Ultimately, a unique method was established that uses light to provide both the bonding energy and the illumination for an in-process vision system for real-time viewing and control of the bonding process. The process results in the generation of a homogenous and optically clear bond, and preliminary tests show that when properly controlled, a bond with minimal microchannel deformation can be created.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Michelle E. Lustrino.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">149 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">The development of an innovative bonding method for microfluidic applications</dim:field>
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   	&lt;Title>The development of an innovative bonding method for microfluidic applications&lt;/Title>
   	&lt;Subtitle>development of an innovative bonding process for microfluidic applications&lt;/Subtitle>
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   	&lt;PublicationDate>2011&lt;/PublicationDate>
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        	&lt;DisplayName>Lustrino, Michelle E. (Michelle Elizabeth)&lt;/DisplayName>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>The field of microfluidics has powerful applications in low-cost healthcare diagnostics, DNA analysis, and fuel cells, among others. As the field moves towards commercialization, the ability to robustly manufacture these devices at low cost is becoming more important. One of the many challenges in microfluidic manufacturing is the reliable sealing of the microfluidic chips once the channels have been generated. This work was an investigation of innovative ways to robustly heat the substrate-cover plate interface of a microfluidic device for the purpose of bonding and sealing the microfluidic channels. An extensive literature review revealed the benefits of interfacial heating, and both simulations and experimental investigations were used to evaluate a few different methods. Ultimately, a unique method was established that uses light to provide both the bonding energy and the illumination for an in-process vision system for real-time viewing and control of the bonding process. The process results in the generation of a homogenous and optically clear bond, and preliminary tests show that when properly controlled, a bond with minimal microchannel deformation can be created.&lt;/Abstract>
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