<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T06:10:50Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/67760" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/67760</identifier><datestamp>2022-01-27T21:15:22Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Duane Boning and Donald Rosenfield.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Rahman, Mehrafshan Tabassum</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Leaders for Global Operations Program.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department" lang="en_US">Leaders for Global Operations Program at MIT</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Engineering Systems Division</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Sloan School of Management</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2011-12-19T18:47:57Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2011-12-19T18:47:57Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2011</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2011</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/67760</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">766761082</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Engineering Systems Division; and, (M.B.A.)--Massachusetts Institute of Technology, Sloan School of Management; in conjunction with the Leaders for Global Operations Program at MIT, 2011.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 64-66).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Mehrafshan Tabassum Rahman.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.B.A.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">66 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by &#xd;
copyright. They may be viewed from this source for any purpose, but &#xd;
reproduction or distribution in any format is prohibited without written &#xd;
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Engineering Systems Division.</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Sloan School of Management.</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Leaders for Global Operations Program.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Competitive pricing and learning in CPU sockets</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">Competitive pricing and learning in central processing unit sockets</dim:field>
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   	&lt;Title>Competitive pricing and learning in CPU sockets&lt;/Title>
   	&lt;Subtitle>Competitive pricing and learning in central processing unit sockets&lt;/Subtitle>
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   	&lt;PublicationDate>2011&lt;/PublicationDate>
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        	&lt;DisplayName>Rahman, Mehrafshan Tabassum&lt;/DisplayName>
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   	&lt;Abstract>An Intel processor can be electrically attached to a PC motherboard permanently or via a component called a socket. Intel defines the critical interfaces between the socket and the processor. Independent suppliers then manufacture the sockets and Intel validates the design of the sockets before they are sold to the original equipment manufacturers (OEMs). Sockets are the preferred mode of processor attachment for OEMs; however, the increase in price when a new socket is introduced has been a source of complaint by OEMs. This project seeks to better understand what factors contribute to socket costs and what can be done to better understand the increase in price when a new socket is released. This thesis provides a complete analysis on socket supplier development costs and determines that there is an optimal market situation that will minimize the socket cost for OEMs. After investigating different factors it is determined that the number of suppliers and level of competition are most strongly correlated with socket price. Furthermore, research shows that experience curves using competition as a factor are the most useful way of understanding socket price. Recommendations on ideal market share by supplier are provided as part of the results.&lt;/Abstract>
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