<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T17:29:25Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/68952" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/68952</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Rohit Karnik.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">O'Hern, Sean C. (Sean Carson)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2012-01-30T17:05:34Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2012-01-30T17:05:34Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2011</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2011</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/68952</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">773826006</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 57-62).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">In this thesis, I present a procedure by which to transfer greater than 25 mm² areas of high-quality graphene synthesized via low-pressure chemical vapor deposition from copper foil to porous support substrates. Large-area, high quality graphene on a porous support would serve as a platform by which to create high efficiency porous graphene membranes for use in liquid and gas-phase separation technologies. In this procedure, we transfer greater than 25 mm² areas of graphene with few holes and tears to both gold Quantifoil Holey Carbon transmission electron microscope grids with 1.2 [mu]m diameter pores and to Sterlitech polycarbonate track etch membranes with 200 nm diameter pores by bonding the substrates to the graphene then wet-etching the copper. The resulting membrane quality is characterized via Raman spectroscopy, scanning electron microscopy, diffraction patterning, and aberration-corrected scanning transmission electron microscopy.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Sean C. O'Hern.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">62 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Development of process to transfer large areas of LPCVD graphene from copper foil to a porous support substrate</dim:field>
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	&lt;Language>eng&lt;/Language>
   	&lt;Title>Development of process to transfer large areas of LPCVD graphene from copper foil to a porous support substrate&lt;/Title>
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   	&lt;PublicationDate>2011&lt;/PublicationDate>
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        	&lt;DisplayName>O&amp;apos;Hern, Sean C. (Sean Carson)&lt;/DisplayName>
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            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>In this thesis, I present a procedure by which to transfer greater than 25 mm² areas of high-quality graphene synthesized via low-pressure chemical vapor deposition from copper foil to porous support substrates. Large-area, high quality graphene on a porous support would serve as a platform by which to create high efficiency porous graphene membranes for use in liquid and gas-phase separation technologies. In this procedure, we transfer greater than 25 mm² areas of graphene with few holes and tears to both gold Quantifoil Holey Carbon transmission electron microscope grids with 1.2 [mu]m diameter pores and to Sterlitech polycarbonate track etch membranes with 200 nm diameter pores by bonding the substrates to the graphene then wet-etching the copper. The resulting membrane quality is characterized via Raman spectroscopy, scanning electron microscopy, diffraction patterning, and aberration-corrected scanning transmission electron microscopy.&lt;/Abstract>
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