2026-09-20T21:39:06Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/694902022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Jung Hoon Chun.
Mukherjee, Ishan
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2012-02-29T18:21:05Z
2012-02-29T18:21:05Z
2011
2011
http://hdl.handle.net/1721.1/69490
775602612
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 83-84).
The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the experimental validation of root cause of process ineffectiveness. A novel visual inspection based grading scale is developed to quantify the amount of residue present. Using the grading scale optimal process parameters were identified and studied. The study finds that power modules are most effectively cleaned in a saponifier based cleaning solution using ultrasonic agitation. Power modules are completely cleaned when washed in an ultrasonic bath at 60°C for 7 minutes, in a saponifier based cleaning solution that is 5% concentration by volume.
by Ishan Mukherjee.
M.Eng.
84 p.
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by
copyright. They may be viewed from this source for any purpose, but
reproduction or distribution in any format is prohibited without written
permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Cleaning process development and optimization in the surface mount assembly line of power modules
Thesis
application/pdf
false
Publication
unknown
unknown
<Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="60f533a7-0b4d-4aaa-b3ab-b94c5cfbfb5f">
<Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type>
<Language>eng</Language>
<Title>Cleaning process development and optimization in the surface mount assembly line of power modules</Title>
<PublishedIn>
<Publication>
</Publication>
</PublishedIn>
<PublicationDate>2011</PublicationDate>
<Authors>
<Author>
<DisplayName>Mukherjee, Ishan</DisplayName>
<Affiliation>
<OrgUnit>
</OrgUnit>
</Affiliation>
</Author>
</Authors>
<Editors>
</Editors>
<Publishers>
<Publisher>
<DisplayName>Massachusetts Institute of Technology</DisplayName>
<OrgUnit />
</Publisher>
</Publishers>
<License>http://dspace.mit.edu/handle/1721.1/7582</License>
<Keyword>Mechanical Engineering.</Keyword>
<Abstract>The cleaning process in the surface mount assembly line of power modules had been found to insufficiently remove solder flux residue from printed circuit board (PCB) assemblies after the process of reflow soldering. This thesis details the development of an optimized cleaning process that effectively removes solder flux residue from PCB assemblies. The first stage of this study involves the experimental validation of root cause of process ineffectiveness. A novel visual inspection based grading scale is developed to quantify the amount of residue present. Using the grading scale optimal process parameters were identified and studied. The study finds that power modules are most effectively cleaned in a saponifier based cleaning solution using ultrasonic agitation. Power modules are completely cleaned when washed in an ultrasonic bath at 60°C for 7 minutes, in a saponifier based cleaning solution that is 5% concentration by volume.</Abstract>
<Access xmlns="http://purl.org/coar/access_right"
>
</Access>
</Publication>