2026-09-18T20:12:45Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/695052022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131024
Paulo Lozano.
Burroughs, Michelle (Michelle L.)
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2012-02-29T18:22:13Z
2012-02-29T18:22:13Z
2011
2011
http://hdl.handle.net/1721.1/69505
775674464
Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2011.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 21-22).
Thermal cycling is a concern to those who use epoxy as an adhesion in space applications due to the mechanical and thermal properties of both the epoxy and adhered materials. These properties include the thermal expansion coefficient, a, and the stress at which the epoxy will yield fracture. An experiment was carried out to find out if failure would occur by thermal cycling of epoxy bonded components in the propulsion components of a small satellite. Failure did not occur due to shear stress attributed to the thermal expansion coefficient but unexpectedly to the liquefaction of epoxy in 3 of the 6 samples. The samples with thicker epoxy layers failed in contrast to the thinner epoxy layer samples. Overall, thermal cycling is still a concern for failure of the epoxy bond.
by Michelle Burroughs.
S.B.
22 p.
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by
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http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Effects of thermal cycling on epoxy bonded materials
Thesis
application/pdf
false
Publication
unknown
unknown
<Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="6d7e8159-bc56-495f-b64c-e8ac73573635">
<Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type>
<Language>eng</Language>
<Title>Effects of thermal cycling on epoxy bonded materials</Title>
<PublishedIn>
<Publication>
</Publication>
</PublishedIn>
<PublicationDate>2011</PublicationDate>
<Authors>
<Author>
<DisplayName>Burroughs, Michelle (Michelle L.)</DisplayName>
<Affiliation>
<OrgUnit>
</OrgUnit>
</Affiliation>
</Author>
</Authors>
<Editors>
</Editors>
<Publishers>
<Publisher>
<DisplayName>Massachusetts Institute of Technology</DisplayName>
<OrgUnit />
</Publisher>
</Publishers>
<License>http://dspace.mit.edu/handle/1721.1/7582</License>
<Keyword>Mechanical Engineering.</Keyword>
<Abstract>Thermal cycling is a concern to those who use epoxy as an adhesion in space applications due to the mechanical and thermal properties of both the epoxy and adhered materials. These properties include the thermal expansion coefficient, a, and the stress at which the epoxy will yield fracture. An experiment was carried out to find out if failure would occur by thermal cycling of epoxy bonded components in the propulsion components of a small satellite. Failure did not occur due to shear stress attributed to the thermal expansion coefficient but unexpectedly to the liquefaction of epoxy in 3 of the 6 samples. The samples with thicker epoxy layers failed in contrast to the thinner epoxy layer samples. Overall, thermal cycling is still a concern for failure of the epoxy bond.</Abstract>
<Access xmlns="http://purl.org/coar/access_right"
>
</Access>
</Publication>