<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-18T22:17:46Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/74442" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/74442</identifier><datestamp>2022-01-13T07:54:36Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131024</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Cullen R. Buie.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Hidayah, Rand (Rand G.)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2012-10-26T18:09:18Z</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2012</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2012</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/74442</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">813167044</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 36).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Insulator based dielectrophoresis (iDEP) is a technique used for sorting microparticles based on their electrical properties which proves to be promising in its development. Using multiple constrictions of area to generate gradients of electric fields allows a device to be made without electrode arrays and at a cheaper cost. The possibility of making devices with multiple constrictions within them is undertaken using micromachining and adhesion methods. The micromachining of multiple constrictions is planned out but further work is needed for optimization. A concept for a commercial device is proposed for low cost fabrication of 3D iDEP devices.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Rand Hidayah.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.B.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">44 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Design of multiple constriction ratio microfluidic channels for 3D insulator based dielectrophoretic chips</dim:field>
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	&lt;Language>eng&lt;/Language>
   	&lt;Title>Design of multiple constriction ratio microfluidic channels for 3D insulator based dielectrophoretic chips&lt;/Title>
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   	&lt;PublicationDate>2012&lt;/PublicationDate>
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        	&lt;DisplayName>Hidayah, Rand (Rand G.)&lt;/DisplayName>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>Insulator based dielectrophoresis (iDEP) is a technique used for sorting microparticles based on their electrical properties which proves to be promising in its development. Using multiple constrictions of area to generate gradients of electric fields allows a device to be made without electrode arrays and at a cheaper cost. The possibility of making devices with multiple constrictions within them is undertaken using micromachining and adhesion methods. The micromachining of multiple constrictions is planned out but further work is needed for optimization. A concept for a commercial device is proposed for low cost fabrication of 3D iDEP devices.&lt;/Abstract>
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