<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T09:25:46Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/75841" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/75841</identifier><datestamp>2022-01-13T07:54:29Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">John G. Kassakian.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Zhang, Richard Yi</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2013-01-07T19:05:34Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2013-01-07T19:05:34Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2012</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2012</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/75841</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">820817737</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2012.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">This electronic version was submitted by the student author.  The certified thesis is available in the Institute Archives and Special Collections.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from student submitted PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 85-90).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">This thesis describes an efficient numerical simulation technique of magnetoquasistatic electromagnetic fields for planar induction heating applications. The technique is based on a volume-element discretization, integral formulation of Maxwell's equations, and uses the multilayer Green's function to avoid volumetric meshing of the heated material. The technique demonstrates two orders of magnitude of computational advantage compared to existing FEM techniques. Single-objective and multiobjective optimization of a domestic induction heating coil are performed using the new technique, using more advanced algorithms than those previously used due to the increase in speed. Both optimization algorithms produced novel, three-dimensional induction coil designs.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Richard Yi Zhang.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">90 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">A generalized approach to planar induction heating magnetics</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
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	&lt;Language>eng&lt;/Language>
   	&lt;Title>A generalized approach to planar induction heating magnetics&lt;/Title>
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   	&lt;PublicationDate>2012&lt;/PublicationDate>
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        	&lt;DisplayName>Zhang, Richard Yi&lt;/DisplayName>
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            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
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    &lt;Keyword>Electrical Engineering and Computer Science.&lt;/Keyword>
   	&lt;Abstract>This thesis describes an efficient numerical simulation technique of magnetoquasistatic electromagnetic fields for planar induction heating applications. The technique is based on a volume-element discretization, integral formulation of Maxwell&amp;apos;s equations, and uses the multilayer Green&amp;apos;s function to avoid volumetric meshing of the heated material. The technique demonstrates two orders of magnitude of computational advantage compared to existing FEM techniques. Single-objective and multiobjective optimization of a domestic induction heating coil are performed using the new technique, using more advanced algorithms than those previously used due to the increase in speed. Both optimization algorithms produced novel, three-dimensional induction coil designs.&lt;/Abstract>
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