2026-09-19T00:25:52Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/781612022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Jung-Hoon Chun.
AlSaeed, Abdulelah (Abdulelah Ibrahim)
Massachusetts Institute of Technology. Dept. of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2013-03-28T18:09:35Z
2013-03-28T18:09:35Z
2012
2012
http://hdl.handle.net/1721.1/78161
829681029
Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012.
Cataloged from PDF version of thesis.
Includes bibliographical references (p. 66).
Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this research, two major causes of poling breakage were identified. First, stresses along substrate edges make PZT substrates more susceptible to breakage if any sort of mechanical force is present. It was determined that these stresses were caused by differential strains due to incomplete metal layer coverage. Second, the electrical arcing that is frequently taking place during poling sends a mechanical shock wave through the substrate. Electrical arcing is caused by metal overspray during the sputtering process. Poling breakage was experimentally reduced by 70% by redesigning the shadow mask used during sputtering to eliminate any metal overspray.
by Abdulelah Alsaeed.
M.Eng.
66 p.
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by
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http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Elimination of PZT thin film breakage caused by electric current arcing and intrinsic differential strains during poling
Elimination of lead zirconate titatate thin film breakage caused by electric current arcing and intrinsic differential strains during poling
Thesis
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Publication
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<Title>Elimination of PZT thin film breakage caused by electric current arcing and intrinsic differential strains during poling</Title>
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<Abstract>Historically, substrate breakage during the poling process has been responsible for a 2% yield loss for a contract manufacturer specializing in volume production of lead zirconate titatate (PZT) thin film devices. In this research, two major causes of poling breakage were identified. First, stresses along substrate edges make PZT substrates more susceptible to breakage if any sort of mechanical force is present. It was determined that these stresses were caused by differential strains due to incomplete metal layer coverage. Second, the electrical arcing that is frequently taking place during poling sends a mechanical shock wave through the substrate. Electrical arcing is caused by metal overspray during the sputtering process. Poling breakage was experimentally reduced by 70% by redesigning the shadow mask used during sputtering to eliminate any metal overspray.</Abstract>
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