2026-09-18T21:12:34Zhttps://dspace.mit.edu/server/oai/request

oai:dspace.mit.edu:1721.1/781652022-01-13T07:54:36Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023

Brian W. Anthony. Judge, Benjamin Michael Massachusetts Institute of Technology. Dept. of Mechanical Engineering. Massachusetts Institute of Technology. Department of Mechanical Engineering 2013-03-28T18:09:58Z 2013-03-28T18:09:58Z 2012 2012 http://hdl.handle.net/1721.1/78165 829681650 Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012. Cataloged from PDF version of thesis. Includes bibliographical references (p. 103-108). The assembly of microfluidic components for lab on a chip (LOC) applications that are manufactured from commodity thermoplastics is challenging. A survey of plastic welding techniques validates that contour transmission laser welding is the most viable and commercially demonstrated option for flexibility and sensitive microfluidic tolerances. However, understanding laser energy transmission and absorption phenomenon further complicates analyzing microfluidic thermoplastic welding, since the instantaneous material properties vary with both temperature and pressure. Thermoplastic welding has steep thermal gradients due to high thermal resistances, resulting in asymmetric heat affected zones (HAZ). Welding fixture sensitivities may be engineered to tune the weld energy required and a desired HAZ bias to reduce microfluidic channel deformation. Energy imparted by resistively heating thin implants can be easily measured and observed. Resistive heating of implants was demonstrated as a low energy, parallel, and feasible microfluidic welding assembly process. Lessons from implant heating can be applied to more complicated but analogous processes. by Benjamin Michael Judge. M.Eng. 108 p. eng Massachusetts Institute of Technology M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 Mechanical Engineering. Thermoplastic bonding of microfluidic substrates Thesis application/pdf false Publication unknown unknown <Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="d941cbf5-71c0-4993-8ecc-5786f4347282"> <Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type> <Language>eng</Language> <Title>Thermoplastic bonding of microfluidic substrates</Title> <PublishedIn> <Publication> </Publication> </PublishedIn> <PublicationDate>2012</PublicationDate> <Authors> <Author> <DisplayName>Judge, Benjamin Michael</DisplayName> <Affiliation> <OrgUnit> </OrgUnit> </Affiliation> </Author> </Authors> <Editors> </Editors> <Publishers> <Publisher> <DisplayName>Massachusetts Institute of Technology</DisplayName> <OrgUnit /> </Publisher> </Publishers> <License>http://dspace.mit.edu/handle/1721.1/7582</License> <Keyword>Mechanical Engineering.</Keyword> <Abstract>The assembly of microfluidic components for lab on a chip (LOC) applications that are manufactured from commodity thermoplastics is challenging. A survey of plastic welding techniques validates that contour transmission laser welding is the most viable and commercially demonstrated option for flexibility and sensitive microfluidic tolerances. However, understanding laser energy transmission and absorption phenomenon further complicates analyzing microfluidic thermoplastic welding, since the instantaneous material properties vary with both temperature and pressure. Thermoplastic welding has steep thermal gradients due to high thermal resistances, resulting in asymmetric heat affected zones (HAZ). Welding fixture sensitivities may be engineered to tune the weld energy required and a desired HAZ bias to reduce microfluidic channel deformation. Energy imparted by resistively heating thin implants can be easily measured and observed. Resistive heating of implants was demonstrated as a low energy, parallel, and feasible microfluidic welding assembly process. Lessons from implant heating can be applied to more complicated but analogous processes.</Abstract> <Access xmlns="http://purl.org/coar/access_right" > </Access> </Publication>