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   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Joseph M. Jacobson.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Bulthaup, Colin A. (Colin Aaron), 1976-</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="accessioned">2013-10-24T17:29:58Z</dim:field>
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   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2001</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2001</dim:field>
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   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">51111279</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (M.Eng. and S.B.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2001.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (leaf 92).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Colin A. Bulthaup.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">M.Eng.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.B.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">93 leaves</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
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   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Liquid embossing : a technique for fabricating sub-micron electrical, mechanical and biological structures</dim:field>
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   	&lt;Title>Liquid embossing : a technique for fabricating sub-micron electrical, mechanical and biological structures&lt;/Title>
   	&lt;Subtitle>Fabricating sub-micron electrical, mechanical and biological structures&lt;/Subtitle>
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