<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-18T22:53:08Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/81623" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/81623</identifier><datestamp>2022-01-13T07:54:05Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">John G. Brisson.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Roche, Nicholas Albert</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2013-10-24T17:36:12Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2013-10-24T17:36:12Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2013</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2013</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/81623</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">859151094</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 89-90).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">The performance of many electronic devices is presently limited by heat dissipation rates. One potential solution lies in high-performance air-cooled heat exchangers like PHUMP, the multiple condenser loop heat pipe presented here. This device features a number of design improvements that lead to significant increases in performance relative to state of the art heat exchangers. In this work, a compensation chamber is developed and implemented to ensure the operational stability of the device across a wide range of operating conditions. A computational model of the device was developed using COMSOL Multiphysics v3.5a to allow for design optimization and performance evaluation. The accuracy of this computational model was established by comparing simulation results to experimental data. Analytical models were used to identify operating points of interest, which were simulated to compare the performance of various designs. The final design featured reduced thermal resistance between the vapor in the evaporator and the compensation chamber, and increased thermal resistance between the compensation chamber and the ambient air relative to past designs. This design reduced the risk of condenser flooding and evaporator dry out, improving the operational stability of the device. This design was implemented into a ten-condenser prototype, where experiments validated its performance. The compensation chamber did not require any electrical heaters, reducing the power consumption of the device and increasing its COP. Finally, general recommendations and guidelines are presented for use during the design process of future compensation chambers.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Nicholas Albert Roche.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">90 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
reproduction or distribution in any format is prohibited without written 
permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Development of a compensation chamber for use in a multiple condenser loop heat pipe</dim:field>
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   	&lt;Title>Development of a compensation chamber for use in a multiple condenser loop heat pipe&lt;/Title>
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   	&lt;PublicationDate>2013&lt;/PublicationDate>
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        	&lt;DisplayName>Roche, Nicholas Albert&lt;/DisplayName>
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            &lt;DisplayName>Massachusetts Institute of Technology&lt;/DisplayName>
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    &lt;License>http://dspace.mit.edu/handle/1721.1/7582&lt;/License>
    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>The performance of many electronic devices is presently limited by heat dissipation rates. One potential solution lies in high-performance air-cooled heat exchangers like PHUMP, the multiple condenser loop heat pipe presented here. This device features a number of design improvements that lead to significant increases in performance relative to state of the art heat exchangers. In this work, a compensation chamber is developed and implemented to ensure the operational stability of the device across a wide range of operating conditions. A computational model of the device was developed using COMSOL Multiphysics v3.5a to allow for design optimization and performance evaluation. The accuracy of this computational model was established by comparing simulation results to experimental data. Analytical models were used to identify operating points of interest, which were simulated to compare the performance of various designs. The final design featured reduced thermal resistance between the vapor in the evaporator and the compensation chamber, and increased thermal resistance between the compensation chamber and the ambient air relative to past designs. This design reduced the risk of condenser flooding and evaporator dry out, improving the operational stability of the device. This design was implemented into a ten-condenser prototype, where experiments validated its performance. The compensation chamber did not require any electrical heaters, reducing the power consumption of the device and increasing its COP. Finally, general recommendations and guidelines are presented for use during the design process of future compensation chambers.&lt;/Abstract>
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