<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-19T19:07:32Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/81732" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/81732</identifier><datestamp>2022-01-13T07:54:05Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">David Hardt.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Bageant, Maia R. (Maia Reynolds)</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Mechanical Engineering</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2013-10-24T18:10:23Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2013-10-24T18:10:23Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2013</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2013</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/81732</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">858811074</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2013.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">This electronic version was submitted by the student author.  The certified thesis is available in the Institute Archives and Special Collections.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from student-submitted PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (p. 121-123).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Microuidic technologies show great promise in simplifying and speeding biological, medical, and fluidic tasks, but transitioning these technologies from a laboratory environment to a production environment has proven difficult. This work focuses on hot embossing as a process suitable to produce these devices. In this work, a precision micro-embossing machine capable of maintaining precise setpoints in force and temperature input as well as displaying highly linear, repeatable motion and force application is developed and characterized. Additionally, this equipment is then outfitted with additional sensors that allow for three measurements relevant to process physics and product quality to be captured: initial substrate geometry; substrate bulk deformation; and glass transition temperature of the material. These measurements can be captured in-process without modifying the production cycle. The end goal is to incorporate this precision micro-embossing machine into a micro-factory cell and to implement closed-loop cycle-to-cycle process control.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Maia R. Bageant.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">123 p.</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by 
copyright. They may be viewed from this source for any purpose, but 
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   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Mechanical Engineering.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Development of a precision hot embossing machine with in-process sensing</dim:field>
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   	&lt;Title>Development of a precision hot embossing machine with in-process sensing&lt;/Title>
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   	&lt;PublicationDate>2013&lt;/PublicationDate>
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        	&lt;DisplayName>Bageant, Maia R. (Maia Reynolds)&lt;/DisplayName>
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    &lt;Keyword>Mechanical Engineering.&lt;/Keyword>
   	&lt;Abstract>Microuidic technologies show great promise in simplifying and speeding biological, medical, and fluidic tasks, but transitioning these technologies from a laboratory environment to a production environment has proven difficult. This work focuses on hot embossing as a process suitable to produce these devices. In this work, a precision micro-embossing machine capable of maintaining precise setpoints in force and temperature input as well as displaying highly linear, repeatable motion and force application is developed and characterized. Additionally, this equipment is then outfitted with additional sensors that allow for three measurements relevant to process physics and product quality to be captured: initial substrate geometry; substrate bulk deformation; and glass transition temperature of the material. These measurements can be captured in-process without modifying the production cycle. The end goal is to incorporate this precision micro-embossing machine into a micro-factory cell and to implement closed-loop cycle-to-cycle process control.&lt;/Abstract>
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