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Vladimir Stojanović. Chen, Yu-Hsin, Ph. D. Massachusetts Institute of Technology Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science. Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science 2013-11-18T19:16:00Z 2013-11-18T19:16:00Z 2013 2013 http://hdl.handle.net/1721.1/82380 862075006 Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2013. Cataloged from PDF version of thesis. Includes bibliographical references (p. 59-61). Monolithically-integrated optical link is a disruptive technology which has the promising potential to remove memory bandwidth bottleneck in the deep multicore regime. Although with the advantages of high bandwidth-density and energy-efficiency, it comes with design challenges from device, architecture and system perspectives. High thermal sensitivity of the essential optical ring resonator imposes constraints on the applicability of optical links in the electro-optical systems. To investigate the thermal dynamics as well as to develop advanced ring thermal-tuning mechanisms, real-time thermal monitoring at design stage is required. In this work we propose a thermal simulation platform which integrates system modeling aspects including the high-level architectural performance model, the physical device evaluation model, and the thermal analysis model. By introducing the compact thermal model with linear transient thermal analysis solver, system thermal dynamics can be monitored at high efficiency. We demonstrate the temperature profile of a multi-core microprocessor system running real workloads. The evaluation results show the system thermal dependence on the manufacturing process, circuit thermal crosstalk and integrated ring heater efficiency. by Yu-Hsin Chen. S.M. 61 p. eng Massachusetts Institute of Technology M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 Electrical Engineering and Computer Science. Investigating thermal dependence on monolithically-integrated photonic interconnects Thesis application/pdf false Publication unknown unknown <Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="954cfbf7-f456-4200-a6a3-490d8a174572"> <Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type> <Language>eng</Language> <Title>Investigating thermal dependence on monolithically-integrated photonic interconnects</Title> <PublishedIn> <Publication> </Publication> </PublishedIn> <PublicationDate>2013</PublicationDate> <Authors> <Author> <DisplayName>Chen, Yu-Hsin, Ph. D. Massachusetts Institute of Technology</DisplayName> <Affiliation> <OrgUnit> </OrgUnit> </Affiliation> </Author> </Authors> <Editors> </Editors> <Publishers> <Publisher> <DisplayName>Massachusetts Institute of Technology</DisplayName> <OrgUnit /> </Publisher> </Publishers> <License>http://dspace.mit.edu/handle/1721.1/7582</License> <Keyword>Electrical Engineering and Computer Science.</Keyword> <Abstract>Monolithically-integrated optical link is a disruptive technology which has the promising potential to remove memory bandwidth bottleneck in the deep multicore regime. Although with the advantages of high bandwidth-density and energy-efficiency, it comes with design challenges from device, architecture and system perspectives. High thermal sensitivity of the essential optical ring resonator imposes constraints on the applicability of optical links in the electro-optical systems. To investigate the thermal dynamics as well as to develop advanced ring thermal-tuning mechanisms, real-time thermal monitoring at design stage is required. In this work we propose a thermal simulation platform which integrates system modeling aspects including the high-level architectural performance model, the physical device evaluation model, and the thermal analysis model. By introducing the compact thermal model with linear transient thermal analysis solver, system thermal dynamics can be monitored at high efficiency. We demonstrate the temperature profile of a multi-core microprocessor system running real workloads. The evaluation results show the system thermal dependence on the manufacturing process, circuit thermal crosstalk and integrated ring heater efficiency.</Abstract> <Access xmlns="http://purl.org/coar/access_right" > </Access> </Publication>