<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-21T03:46:52Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/85461" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/85461</identifier><datestamp>2026-06-16T18:55:14Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131022</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Henry I. Smith.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Fucetola, Corey Patrick</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2014-03-06T15:43:41Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2014-03-06T15:43:41Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2013</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2013</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/85461</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">870969053</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: Ph. D., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2013.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (pages 153).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">This thesis considers the viability of nanomembrane handling and stacking approaches to enable the fabrication of three-dimensional (3D) nano-structured materials. Sequentially stacking previously-patterned membranes to build up 3D nanostructures, e.g. photonic crystals, is a powerful technique that decouples serial patterning processes from 3D assembly, allows the incorporation of photonic devices into the material and facilitates in-process error inspection. A technique identified to address the fundamental problems with stacking disjoined membranes, i.e. those populated with photonic devices, using water-based approaches was an outgrowth of methods to fabricate, handle and stack their connected counterparts. Initially, connected nanomembranes patterned in a thin layer of silicon on glass were released in hydrofluoric acid where surface tension caused them to float flat. Their fragility inspired novel handling and position manipulation techniques for layer-to-layer alignment. While exploiting surface tension allowed membranes to be stacked using water, drifting precluded precision placement. Although carrier substrates held them stationary, the membranes leaked water before Van-der Waals adhesion was overcome. To address such issues a novel method is introduced whereby a sublimable glue affixes membranes to a glass carrier, which is placed membrane-side down onto a receiving substrate and the glue is vaporized to detach the membranes, leaving them bound to the previous layer.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by Corey Patrick Fucetola.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">Ph.D.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">153 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Electrical Engineering and Computer Science.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Three-dimensional nanostructures fabricated by stacking pre-patterned monocrystalline silicon nanomembranes</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">3-dimensional nanostructures fabricated by stacking pre-patterned monocrystalline silicon nanomembranes</dim:field>
   <dim:field mdschema="dc" element="title" qualifier="alternative" lang="en_US">3D nanostructures fabricated by stacking pre-patterned monocrystalline silicon nanomembranes</dim:field>
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   	&lt;Title>Three-dimensional nanostructures fabricated by stacking pre-patterned monocrystalline silicon nanomembranes&lt;/Title>
   	&lt;Subtitle>3-dimensional nanostructures fabricated by stacking pre-patterned monocrystalline silicon nanomembranes&lt;/Subtitle>
   	&lt;Subtitle>3D nanostructures fabricated by stacking pre-patterned monocrystalline silicon nanomembranes&lt;/Subtitle>
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   	&lt;PublicationDate>2013&lt;/PublicationDate>
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        	&lt;DisplayName>Fucetola, Corey Patrick&lt;/DisplayName>
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    &lt;Keyword>Electrical Engineering and Computer Science.&lt;/Keyword>
   	&lt;Abstract>This thesis considers the viability of nanomembrane handling and stacking approaches to enable the fabrication of three-dimensional (3D) nano-structured materials. Sequentially stacking previously-patterned membranes to build up 3D nanostructures, e.g. photonic crystals, is a powerful technique that decouples serial patterning processes from 3D assembly, allows the incorporation of photonic devices into the material and facilitates in-process error inspection. A technique identified to address the fundamental problems with stacking disjoined membranes, i.e. those populated with photonic devices, using water-based approaches was an outgrowth of methods to fabricate, handle and stack their connected counterparts. Initially, connected nanomembranes patterned in a thin layer of silicon on glass were released in hydrofluoric acid where surface tension caused them to float flat. Their fragility inspired novel handling and position manipulation techniques for layer-to-layer alignment. While exploiting surface tension allowed membranes to be stacked using water, drifting precluded precision placement. Although carrier substrates held them stationary, the membranes leaked water before Van-der Waals adhesion was overcome. To address such issues a novel method is introduced whereby a sublimable glue affixes membranes to a glass carrier, which is placed membrane-side down onto a receiving substrate and the glue is vaporized to detach the membranes, leaving them bound to the previous layer.&lt;/Abstract>
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