2026-09-20T05:17:46Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/883852022-01-13T07:54:05Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
Tonio Buonassisi.
Castellanos RodrÃguez, Sergio
Massachusetts Institute of Technology. Department of Mechanical Engineering.
Massachusetts Institute of Technology. Department of Mechanical Engineering
2014-07-11T21:07:58Z
2014-07-11T21:07:58Z
2014
2014
http://hdl.handle.net/1721.1/88385
881193224
Thesis: S.M., Massachusetts Institute of Technology, Department of Mechanical Engineering, 2014.
Cataloged from PDF version of thesis.
Includes bibliographical references (pages 96-102).
One of the parameters with highest impact on photovoltaic module cost is manufacturing yield during solar cell production. Yield is, to a great extent, directly affected by the crystallization technique used to grow the substrate wafers due to its role in generating residual stresses that can lead to fracture upon wafer processing and handling. This thesis explores the nature, impact, and a method for quantifying residual stresses in silicon wafers used for solar cells. The combination of an infrared birefringence imaging technique along with a sectioning method is proposed as an approach to spatially resolve and decouple the in-plane residual stress components on four wafers originating from different growth methods. The suitability of this technique is verified, and recommendations for future expansion of this work are presented.
by Sergio Castellanos Rodriguez.
S.M.
102 pages
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Mechanical Engineering.
Application of infrared birefringence imaging for measuring residual stress in multicrystalline, quasi-mono, dendritic web, and string ribbon silicon for solar cells
Thesis
application/pdf
false
Publication
unknown
unknown
<Publication xmlns="https://www.openaire.eu/cerif-profile/1.1/" id="9536cc18-0b0c-49c8-8249-f5ba27df2e04">
<Type xmlns="https://www.openaire.eu/cerif-profile/vocab/COAR_Publication_Types">http://purl.org/coar/resource_type/c_1843</Type>
<Language>eng</Language>
<Title>Application of infrared birefringence imaging for measuring residual stress in multicrystalline, quasi-mono, dendritic web, and string ribbon silicon for solar cells</Title>
<PublishedIn>
<Publication>
</Publication>
</PublishedIn>
<PublicationDate>2014</PublicationDate>
<Authors>
<Author>
<DisplayName>Castellanos RodrÃguez, Sergio</DisplayName>
<Affiliation>
<OrgUnit>
</OrgUnit>
</Affiliation>
</Author>
</Authors>
<Editors>
</Editors>
<Publishers>
<Publisher>
<DisplayName>Massachusetts Institute of Technology</DisplayName>
<OrgUnit />
</Publisher>
</Publishers>
<License>http://dspace.mit.edu/handle/1721.1/7582</License>
<Keyword>Mechanical Engineering.</Keyword>
<Abstract>One of the parameters with highest impact on photovoltaic module cost is manufacturing yield during solar cell production. Yield is, to a great extent, directly affected by the crystallization technique used to grow the substrate wafers due to its role in generating residual stresses that can lead to fracture upon wafer processing and handling. This thesis explores the nature, impact, and a method for quantifying residual stresses in silicon wafers used for solar cells. The combination of an infrared birefringence imaging technique along with a sectioning method is proposed as an approach to spatially resolve and decouple the in-plane residual stress components on four wafers originating from different growth methods. The suitability of this technique is verified, and recommendations for future expansion of this work are presented.</Abstract>
<Access xmlns="http://purl.org/coar/access_right"
>
</Access>
</Publication>