2026-09-20T10:38:29Zhttps://dspace.mit.edu/server/oai/requestoai:dspace.mit.edu:1721.1/89922022-01-13T07:54:33Zcom_1721.1_7582com_1721.1_7581col_1721.1_131023
L.C. Kimerling.
Haberer, Elaine D. (Elaine Denise), 1975-
Massachusetts Institute of Technology. Dept. of Materials Science and Engineering.
Massachusetts Institute of Technology. Department of Materials Science and Engineering
2005-09-27T19:45:16Z
2005-09-27T19:45:16Z
1998
1998
http://hdl.handle.net/1721.1/8992
47264889
Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1998.
Includes bibliographical references (p. 77-79).
The interlayer dielectric plays an important role in multilevel integration. Material choice, processing, and contamination greatly impact the performance of the layer. In this study, particle generation, deposition, and adhesion mechanisms are reviewed. In particular, four important sources of interlayer dielectric particle contamination were investigated: the cleanroom environment, improper wafer handling, the backside of the wafer, and microarcing during process.
by Elaine D. Haberer.
S.M.
79 p.
5662129 bytes
5661889 bytes
application/pdf
application/pdf
eng
Massachusetts Institute of Technology
M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.
http://dspace.mit.edu/handle/1721.1/7582
Materials Science and Engineering.
Particle generation in a chemical vapor deposition/plasma-enhanced chemical vapor deposition interlayer dielectric tool
Thesis
application/pdf
Publication
unknown
unknown
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