<?xml version="1.0" encoding="UTF-8"?><?xml-stylesheet type="text/xsl" href="static/style.xsl"?><OAI-PMH xmlns="http://www.openarchives.org/OAI/2.0/" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xsi:schemaLocation="http://www.openarchives.org/OAI/2.0/ http://www.openarchives.org/OAI/2.0/OAI-PMH.xsd"><responseDate>2026-09-18T22:56:52Z</responseDate><request verb="GetRecord" identifier="oai:dspace.mit.edu:1721.1/95609" metadataPrefix="dim">https://dspace.mit.edu/server/oai/request</request><GetRecord><record><header><identifier>oai:dspace.mit.edu:1721.1/95609</identifier><datestamp>2022-01-18T17:09:13Z</datestamp><setSpec>com_1721.1_7582</setSpec><setSpec>com_1721.1_7581</setSpec><setSpec>col_1721.1_131023</setSpec></header><metadata><dim:dim xmlns:dim="http://www.dspace.org/xmlns/dspace/dim" xmlns:xsi="http://www.w3.org/2001/XMLSchema-instance" xmlns:doc="http://www.lyncode.com/xoai" xsi:schemaLocation="http://www.dspace.org/xmlns/dspace/dim http://www.dspace.org/schema/dim.xsd">
   <dim:field mdschema="dc" element="contributor" qualifier="advisor" lang="en_US">Neil A. Gershenfeld.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="author" lang="en_US">Langford, William Kai</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="other" lang="en_US">Massachusetts Institute of Technology. Department of Architecture. Program in Media Arts and Sciences.</dim:field>
   <dim:field mdschema="dc" element="contributor" qualifier="department">Program in Media Arts and Sciences (Massachusetts Institute of Technology)</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="accessioned">2015-02-25T17:13:42Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="available">2015-02-25T17:13:42Z</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="copyright" lang="en_US">2014</dim:field>
   <dim:field mdschema="dc" element="date" qualifier="issued" lang="en_US">2014</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="uri">http://hdl.handle.net/1721.1/95609</dim:field>
   <dim:field mdschema="dc" element="identifier" qualifier="oclc" lang="en_US">903903983</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Thesis: S.M., Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2014.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Cataloged from PDF version of thesis.</dim:field>
   <dim:field mdschema="dc" element="description" lang="en_US">Includes bibliographical references (pages 107-109).</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="abstract" lang="en_US">Digital materials are constructions assembled from a small number of types of discrete building blocks; they represent a new way of building functional, multi-material, three-dimensional structures. In this thesis, I focus on the construction of microelectronics from vertically assemble-able two-dimensional parts. With just a conducting and insulating part-type, I show that it is possible to make discretely assembled electrical networks. With a third resistive part-type, I show that it is possible to make any passive electronic component and complex impedance circuitry, including antennas and matching networks. Finally, with four semiconducting part-types I suggest that it is possible to assemble active components like diodes and transistors. This work details the part production processes to create two-dimensional micro-bricks, modeling and assembly strategies to create functional structures from discrete parts, the measurement and evaluation of the bulk properties of the assemblies, and experiments in assembly automation.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="statementofresponsibility" lang="en_US">by William Kai Langford.</dim:field>
   <dim:field mdschema="dc" element="description" qualifier="degree" lang="en_US">S.M.</dim:field>
   <dim:field mdschema="dc" element="format" qualifier="extent" lang="en_US">109 pages</dim:field>
   <dim:field mdschema="dc" element="language" qualifier="iso" lang="en_US">eng</dim:field>
   <dim:field mdschema="dc" element="publisher" lang="en_US">Massachusetts Institute of Technology</dim:field>
   <dim:field mdschema="dc" element="rights" lang="en_US">M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.</dim:field>
   <dim:field mdschema="dc" element="rights" qualifier="uri" lang="en_US">http://dspace.mit.edu/handle/1721.1/7582</dim:field>
   <dim:field mdschema="dc" element="subject" lang="en_US">Architecture. Program in Media Arts and Sciences.</dim:field>
   <dim:field mdschema="dc" element="title" lang="en_US">Electronic digital materials</dim:field>
   <dim:field mdschema="dc" element="type" lang="en_US">Thesis</dim:field>
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   	&lt;Title>Electronic digital materials&lt;/Title>
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   	&lt;PublicationDate>2014&lt;/PublicationDate>
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    &lt;Keyword>Architecture. Program in Media Arts and Sciences.&lt;/Keyword>
   	&lt;Abstract>Digital materials are constructions assembled from a small number of types of discrete building blocks; they represent a new way of building functional, multi-material, three-dimensional structures. In this thesis, I focus on the construction of microelectronics from vertically assemble-able two-dimensional parts. With just a conducting and insulating part-type, I show that it is possible to make discretely assembled electrical networks. With a third resistive part-type, I show that it is possible to make any passive electronic component and complex impedance circuitry, including antennas and matching networks. Finally, with four semiconducting part-types I suggest that it is possible to assemble active components like diodes and transistors. This work details the part production processes to create two-dimensional micro-bricks, modeling and assembly strategies to create functional structures from discrete parts, the measurement and evaluation of the bulk properties of the assemblies, and experiments in assembly automation.&lt;/Abstract>
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