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dc.contributor.advisorLionel C. Kimerling.en_US
dc.contributor.authorYu, Wei, Ph. D. Massachusetts Institute of Technologyen_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Materials Science and Engineering.en_US
dc.date.accessioned2018-09-17T15:54:51Z
dc.date.available2018-09-17T15:54:51Z
dc.date.copyright2018en_US
dc.date.issued2018en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/118038
dc.descriptionThesis: Ph. D., Massachusetts Institute of Technology, Department of Materials Science and Engineering, 2018.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references.en_US
dc.description.abstractThe evolution of data center network interconnects is based: at the component level, on cost, power, and bandwidth density; and at the system level, on cost, unit count, footprint, and implementation time. The decision for iterative vs. transformational design depends critically on the product horizon view that amortizes R&D, manufacture tooling and infrastructure preparation. An iterative platform can be implemented earlier, but it may present limited performance scalability. A transformational design can have large creation and implementation costs that are amortized over a longer time window. A framework for quantitatively capturing these variables using a new technology inventory model is developed. Scenarios for deployment of six different transceiver package platforms to meet the projected data center capacity scaling ramp are constructed. The iterative designs provide better return on investment for a 3-year time window, while the transformational designs are optimized for a 20-year window.en_US
dc.description.statementofresponsibilityby Wei Yu.en_US
dc.format.extent121 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsMIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectMaterials Science and Engineering.en_US
dc.titleTechno-economical evaluation of intra-datacenter optical transceiver designsen_US
dc.typeThesisen_US
dc.description.degreePh. D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Materials Science and Engineering
dc.identifier.oclc1051459050en_US


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