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dc.contributor.advisorJohn Kassakian and Anant Balakrishnan.en_US
dc.contributor.authorSoederberg, Eric Martinen_US
dc.date.accessioned2005-08-15T19:29:42Z
dc.date.available2005-08-15T19:29:42Z
dc.date.copyright1992en_US
dc.date.issued1992en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/12889
dc.descriptionThesis (M.S.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 1992 and Thesis (M.S)--Sloan School of Management, 1992.en_US
dc.descriptionIncludes bibliographical references (p. 72-73).en_US
dc.description.statementofresponsibilityby Eric Martin Soederberg.en_US
dc.format.extent78 p.en_US
dc.format.extent5847950 bytes
dc.format.extent5847708 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Scienceen_US
dc.subjectSloan School of Managementen_US
dc.titleUsing defect data to characterize assembly process capabilities and constraints for printed-circuit-board design for assemblyen_US
dc.typeThesisen_US
dc.description.degreeM.Sen_US
dc.description.degreeM.S.en_US
dc.contributor.departmentSloan School of Managementen_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc27828606en_US


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