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Passive microfluidic interconnects

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dc.contributor.advisor Alexander H. Slocum. en_US
dc.contributor.author Jonnalagadda, Aparna S en_US
dc.contributor.other Massachusetts Institute of Technology. Dept. of Mechanical Engineering. en_US
dc.date.accessioned 2006-05-15T20:40:38Z
dc.date.available 2006-05-15T20:40:38Z
dc.date.copyright 2005 en_US
dc.date.issued 2005 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/32939
dc.description Thesis (S.B.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2005. en_US
dc.description Includes bibliographical references (leaf 44). en_US
dc.description.abstract Equipment and procedures were developed to test two passive microfluidic interconnect rings held together by the friction forces on the contact surfaces. The second design forms fluid seals by means of thin flared rings of compliant material being compressed into undersized sockets. Interconnects were tested in pairs and arrays. The sealing performance of the first design was found to be highly dependent on the material and surface finish of the features, and the design was found to be largely intolerant to the misalignment inherent in arrays. The second design successfully seals up to 150 psi and is capable of compensating for misalignment to seal in arrays of six interconnects. en_US
dc.description.provenance Made available in DSpace on 2006-05-15T20:40:38Z (GMT). No. of bitstreams: 2 62783565.pdf: 2840607 bytes, checksum: 58850583062ec4c08f776983080b81b5 (MD5) 62783565-MIT.pdf: 2841108 bytes, checksum: 28027c8b43755d1aff243bb48e3d2d86 (MD5) Previous issue date: 2005 en
dc.description.statementofresponsibility by Aparna S. Jonnalagadda. en_US
dc.format.extent 48 leaves en_US
dc.format.extent 2840607 bytes
dc.format.extent 2841108 bytes
dc.format.mimetype application/pdf
dc.format.mimetype application/pdf
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582
dc.subject Mechanical Engineering. en_US
dc.title Passive microfluidic interconnects en_US
dc.type Thesis en_US
dc.description.degree S.B. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Mechanical Engineering. en_US
dc.identifier.oclc 62783565 en_US

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