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Redefining manufacturing quality control in the electronics industry

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dc.contributor.advisor Thomas W. Eager and Roy E. Welsch. en_US
dc.contributor.author Simington, Maureen Fresquez, 1970- en_US
dc.contributor.other Leaders for Manufacturing Program. en_US
dc.date.accessioned 2006-11-08T16:23:34Z
dc.date.available 2006-11-08T16:23:34Z
dc.date.copyright 2000 en_US
dc.date.issued 2000 en_US
dc.identifier.uri http://theses.mit.edu/Dienst/UI/2.0/Describe/0018.mit.theses%2f2000-89 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/34709
dc.description Thesis (S.M.)--Massachusetts Institute of Technology, Sloan School of Management; and, (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering; in conjunction with the Leaders for Manufacturing Program, Massachusetts Institute of Technology, 2000. en_US
dc.description Also available online at the MIT Theses Online homepage <http://thesis.mit.edu>. en_US
dc.description Includes bibliographical references (p. 103). en_US
dc.description.abstract The most time consuming and capital intensive portion in the assembly of power electronic devices is the test system. A comprehensive test system including functional and stress screening technologies can significantly increase assembly times and more than double the capital investment required in a new assembly line. The primary purpose of the test system is to screen components for early life failures and to verify proper assembly. Determination of key performance characteristics and the resultant test system are developed during the product design phase and are seldom revised after the product has been released to manufacturing. This thesis explores best practices in testing methods and develops new methods to analyze test system performance. Both efforts were conducted in an effort to optimize existing test regimes. Upon completion of the above analyses the existing test sequence was reduced by 50%. This was primarily due to a discovery in the Burn In test cycle which indicated that failures correlated strongly with the on/off cycles inherent in the test sequence. A new test cycle was proposed to accommodate this finding and test results verified the initial hypothesis. Additionally, the summary of best practices identified new forms of product testing including Highly Accelerated Stress Testing (HAST), moving additional product testing into the development phase consequently reducing testing requirements during assembly. en_US
dc.description.statementofresponsibility by Maureen Fresquez Simington. en_US
dc.format.extent 104 p. en_US
dc.format.extent 8066148 bytes
dc.format.extent 8065906 bytes
dc.format.mimetype application/pdf
dc.format.mimetype application/pdf
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://theses.mit.edu/Dienst/UI/2.0/Describe/0018.mit.theses%2f2000-89 en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582
dc.subject Sloan School of Management. en_US
dc.subject Materials Science and Engineering. en_US
dc.subject Leaders for Manufacturing Program. en_US
dc.title Redefining manufacturing quality control in the electronics industry en_US
dc.type Thesis en_US
dc.description.degree S.M. en_US
dc.contributor.department Sloan School of Management. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.contributor.department Leaders for Manufacturing Program. en_US
dc.identifier.oclc 45502995 en_US


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