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dc.contributor.advisorDarrell J. Irvine.en_US
dc.contributor.authorDoh, Junsangen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Chemical Engineering.en_US
dc.date.accessioned2008-01-10T17:26:08Z
dc.date.available2008-01-10T17:26:08Z
dc.date.copyright2006en_US
dc.date.issued2006en_US
dc.identifier.urihttp://dspace.mit.edu/handle/1721.1/35133en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/35133
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Chemical Engineering, 2006.en_US
dc.descriptionVita.en_US
dc.descriptionIncludes bibliographical references (leaves 128-137).en_US
dc.description.abstractT cells are activated by recognition of foreign peptides displayed on the surface of antigen presenting cells (APCs), an event that triggers assembly of a complex microscale structure at the T cell-APC interface known as the immunological synapse (IS). It remains unresolved whether the unique physical structure of the synapse itself impacts the functional response of T cells, independent of the quantity and quality of ligands encountered by the T cell. As a first step toward addressing this question, we fabricated multicomponent protein surfaces that surrogate the role of APCs and studied T cell responses as a function of synapse structure. To pattern multiple proteins on surfaces, we synthesized and characterized a new polymer, poly(o-ntrobenzyl methacrylate-r-methyl methacrylate-poly(ethylene glycol) methacrylate (PNMP), a photoresist that can be processed under mild aqueous conditions. Based on the pH- and temperature-sensitive solubility of UV-exposed PNMP random terpolymers in aqueous buffers, two-component protein patterning was achieved under conditions that avoid exposing proteins to conditions outside the narrow range of physiological pH, ionic strength, and temperature where their stability is greatest.en_US
dc.description.abstract(cont.) Using a photolithographic strategy we developed employing this novel PNMP photoresist polymer, we created multicomponent protein surfaces presenting micron-scale arrays of tethered T cell receptor (TCR) ligands (anti-CD3 'activation sites') surrounded by a field of tethered intercellular adhesion molecule-I (ICAM-1), as a model substrate on which T cells could be seeded to mimic T cell-APC interactions. CD4+ T cells seeded on these surfaces polarized and migrated; on contact with activation sites, T cells assembled an IS with a structure modulated by the physical pattern of ligand encountered. On surfaces patterned with focal spots of TCR ligand, T cells stably interacted with activation sites, proliferated, and secreted cytokines. In contrast, T cells interacting with activation sites patterned to preclude centralized clustering of TCR ligand failed to form stable contacts with activation sites, exhibited aberrant PKC-[Theta] clustering in a fraction of cells, and had significantly reduced production of interferon-[gamma]. These results suggest that focal clustering of TCR ligand characteristic of the 'mature' IS may be required under some conditions for full T cell activation.en_US
dc.description.statementofresponsibilityby Junsang Doh.en_US
dc.format.extent140 leavesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/35133en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectChemical Engineering.en_US
dc.titleImmunological synapse arrays : patterned protein surfaces that modulate immunological synapse structure formation in T cellsen_US
dc.title.alternativePatterned protein surfaces that modulate immunological synapse structure formation in T cellsen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Chemical Engineering
dc.identifier.oclc71825520en_US


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