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dc.contributor.advisorDavid E. Hardt.en_US
dc.contributor.authorWang, Qi, S.M. Massachusetts Institute of Technologyen_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Mechanical Engineering.en_US
dc.date.accessioned2007-01-10T16:56:26Z
dc.date.available2007-01-10T16:56:26Z
dc.date.issued2006en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/35651
dc.descriptionThesis (S.M.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2006.en_US
dc.description"June 2006."en_US
dc.descriptionIncludes bibliographical references.en_US
dc.description.abstractThe micro embossing process on polymethylmethacrylate (PMMA) is demonstrated experimentally to be a useful process to produce micro fluidic and optical devices. Because this process is a one step thermoplastic deformation process, it is possible to reach high production rates and low cost in manufacturing compared to the standard clean room processes. Currently, the research about this process is still on the feasibility level, with not a quantitative work to optimize the process parameters and assure product quality. In this thesis, an experimental study on process window and variation of Micro Embossing is presented. This study includes the design and manufacturing of an embossing die, the development of an embossing product quality assessment protocol, the process window characterization and the process variation identification. The research results based on the experimental set up in this thesis show that we should apply constant 800N embossing force at an embossing velocity of 1000N/min in order to obtain well formed parts to maintain low process cycle time.en_US
dc.description.abstract(cont.) An embossing temperature of 120°C and de-embossing temperature of 55°C are shown to be the optimal embossing condition to yield good replication and repeatability. These embossing parameters operating window can change with the variation of working piece material, die material and die design.en_US
dc.description.statementofresponsibilityby Qi Wang.en_US
dc.format.extent188 p.en_US
dc.format.extent11875724 bytes
dc.format.extent11883666 bytes
dc.format.mimetypeapplication/pdf
dc.format.mimetypeapplication/pdf
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectMechanical Engineering.en_US
dc.titleProcess window and variation characterization of the micro embossing processen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Mechanical Engineering
dc.identifier.oclc76761424en_US


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