Browsing Singapore-MIT Alliance (SMA) by Title
Now showing items 263-282 of 554
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Machine Learning Approaches to Modeling the Physiochemical Properties of Small Peptides
(2006-01)Peptide and protein sequences are most commonly represented as a strings: a series of letters selected from the twenty character alphabet of abbreviations for the naturally occurring amino acids. Here, we experiment with ... -
Magnetically-Assisted Statistical Assembly - a new heterogeneous integration technique
(2002-01)This paper presents a new technique for the monolithic heterogeneous integration of compound semiconductor devices with silicon integrated circuits, and establishes the theoretical foundation for a key element of the ... -
Magnetophoresis of Nonmagnetic, Submicrometer Particles in Magnetic Fluids
(2004-01)We studied the migration of nonmagnetic, submicrometer polystyrene beads submerged in a magnetic fluid in the presence of nonuniform magnetic fields as a potential method for size-based separation of submicrometer, nonmagnetic ... -
Mapping Unstructured Parallelism to Series-Parallel DAGs
(2004-01)Many parallel programming languages allow programmers to describe parallelism by using constructs such as fork/join. When executed, such programs can be modeled as directed graphs, with nodes representing a computation and ... -
Markov Process Modeling of A System Under WIPLOAD Control
(2005-01)This paper analyzes a proposed release controlmethodology, WIPLOAD Control (WIPLCtrl), using a transfer line case modeled by Markov process modeling methodology. The performance of WIPLCtrl is compared with that of CONWIP ... -
Matching Interest Points Using Projective Invariant Concentric Circles
(2005-01)We present a new method to perform reliable matching between different images. This method exploits a projective invariant property between concentric circles and the corresponding projected ellipses to find complete region ... -
Material and Product Design Integration: Establishing Relationships between Design Variables of Both Domains
(2004-01)Due to the increasing demand of application-specific and/or multi-functional materials, it is necessary to integrate material design and product design. To support such design integration, this paper proposes a methodology ... -
MATLAB*G: A Grid-Based Parallel MATLAB
(2004-01)This paper describes the design and implementation of MATLAB*G, a parallel MATLAB on the ALiCE Grid. ALiCE (Adaptive and scaLable internet-based Computing Engine), developed at NUS, is a lightweight grid-computing middleware. ... -
MATLAB*P 2.0: A unified parallel MATLAB
(2003-01)MATLAB is one of the most widely used mathematical computing environments in technical computing. It is an interactive environment that provides high performance computational routines and an easy-to-use, C-like scripting ... -
Mechanical Characterization of the Heat Affected Zone of Gold Wirebonds Using Nanoindentation
(2002-01)With increasing miniaturization in microelectronics the wirebonds used in IC packages are witnessing a thrust towards fine pitch wirebonding. To have a precise control over loop height of the wirebond for fine pitch ... -
A Mechanical Model for Erosion in Copper Chemical-Mechanical Polishing
(2003-01)The Chemical-mechanical polishing (CMP) process is now widely employed in the ultralarge scale integration chip fabrication. Due to the continuous advances in semiconductor fabrication technology and decreasing sub-micron ... -
Mechanical Properties of Bulk Metallic Glasses and Composites
(2004-01)We have studied the mechanical properties of monolithic bulk metallic glasses and composite in the La based alloys. La₈₆₋yAl₁₄(Cu, Ni)y (y=24 to 32) alloy systems was used to cast the ... -
Mechanical properties of La-based bulk amorphous alloy and composites
(2003-01)Influence of different microstructure of La-based fully amorphous samples and its composites on the impact fracture energy were investigated and discussed. Results showed improvement in fracture energy of glassy metals ... -
Mechanics,Mechanisms and Modeling of the Chemical Mechanical Polishing Process
(2002-01)The Chemical Mechanical polishing (CMP) process is now widely employed in the Integrated Circuit Fabrication. However, due to the complexity of process parameters on the material removal rate (MRR), mechanism of material ... -
A Media Player for Use in Distance Education
(2004-01)We have developed a media player for use in distance education. The player can incorporate several time-indexed sources, including video, audio, PowerPoint, and text index. We have converted all the SMA 5503 Introduction ... -
Memory Hierarchy Hardware-Software Co-design in Embedded Systems
(2005-01)The memory hierarchy is the main bottleneck in modern computer systems as the gap between the speed of the processor and the memory continues to grow larger. The situation in embedded systems is even worse. The memory ... -
Memory Usage Inference for Object-Oriented Programs
(2005-01)We present a type-based approach to statically derive symbolic closed-form formulae that characterize the bounds of heap memory usages of programs written in object-oriented languages. Given a program with size and alias ... -
MEMS Materials and Processes: a research overview
(2003-01)An overview is provided of materials and processes research currently being conducted in support of MEMS device design at MIT. Underpinning research is being conducted in five areas: room temperature strength characterization, ... -
A Meshfree Weak- Strong-form (MWS) method for solid and fluid mechanics
(2004-01)Mesh free methods can be largely categorized into two main categories: mesh free methods based on strong forms (e.g. collocation methods) and mesh free methods based on the weak forms (EFG, MLPG, PIM, etc.; see Mesh Free ... -
Metallic Cluster Coalescence: Molecular Dynamics Simulations of Boundary Formation
(2003-01)During the evaporative deposition of polycrystalline thin films, the development of a tensile stress at small film thicknesses is associated with island coalescence. Several continuum models exist to describe the magnitude ...
