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dc.contributor.advisorLionel C. Kimerling.en_US
dc.contributor.authorGiziewicz, Wojciech Piotr, 1977-en_US
dc.contributor.otherMassachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science.en_US
dc.date.accessioned2007-08-03T18:26:52Z
dc.date.available2007-08-03T18:26:52Z
dc.date.copyright2006en_US
dc.date.issued2006en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/38297
dc.descriptionThesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2006.en_US
dc.descriptionIncludes bibliographical references (p. 233-240).en_US
dc.description.abstractThe majority of photodetectors presented in the literature, or available commercially, have dimensions on the order of 50 Ym or smaller, suitable for glass multimode or single mode fibre applications. The recent successful commercialisation of very large core diameter plastic optical fibre in systems based around 650 nm emitters, as well as the recent emergence of new polymer materials enabling relatively low loss at the more standard 780 nm and 850 nm wavelengths, has exposed the need for integrated photodetectors with dimensions well above 100 /m and capable of bitrates from 250 Mb/s for low-cost consumer applications to multiple Gb/s for high performance short reach interconnects. This size-performance regime has been largely ignored until now. This work examines interdigitated detector structures in multiple material systems by measurement and simulation. An optoelectronic frequency response measurement system was designed and implemented for this work, allowing measurement up to 8 GHz using 850 nm or 1550 nm sources. The full expression for frequency response of diffusion current under different illumination scenarios was derived, a topic normally omitted in the discussion of photodetectors, and applied to the analysis of device measurements.en_US
dc.description.abstract(cont.) Silicon detectors of various geometries were fabricated, with measured bandwidths at 5 V reverse bias up to 2 GHz for 200 ym diameter devices and 4 GHz for 50 and 100 ym diameter devices. The latter is the highest bandwidth reported for a silicon detector fabricated in a CMOS-compatible process and biased at a practically accessible voltage. Device performance was confirmed by simulation, and a novel structure is proposed featuring a buried junction on SOI determined by simulation to have twice as high a responsivity-bandwidth product as the best reported devices fabricated on high resistivity SOI. The silicon device structure was modified for epitaxial germanium wafers, and devices were fabricated. The germanium devices were simulated to determine the appropriate technology scaling direction and maximum device dimensions for desired performance specifications.en_US
dc.description.statementofresponsibilityby Wojciech Piotr Giziewicz.en_US
dc.format.extent240 p.en_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582
dc.subjectElectrical Engineering and Computer Science.en_US
dc.titleHigh performance photodetectors for multimode optical data linksen_US
dc.typeThesisen_US
dc.description.degreePh.D.en_US
dc.contributor.departmentMassachusetts Institute of Technology. Department of Electrical Engineering and Computer Science
dc.identifier.oclc153916319en_US


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