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Investigating packaging effects on bandgap references

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dc.contributor.advisor Tick Houk and Charles Sodini. en_US
dc.contributor.author Palakodety, Ravi (Ravi Kiran) en_US
dc.contributor.other Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. en_US
dc.date.accessioned 2008-05-19T16:06:51Z
dc.date.available 2008-05-19T16:06:51Z
dc.date.copyright 2007 en_US
dc.date.issued 2007 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/41665
dc.description Thesis (M. Eng.)--Massachusetts Institute of Technology, Dept. of Electrical Engineering and Computer Science, 2007. en_US
dc.description Includes bibliographical references (p. 95-96). en_US
dc.description.abstract This thesis investigates packaging effects on precision bandgap voltage references used in LTC switching regulators. Packaging stress causes a mean offset and room temperature distribution widening of the bandgap reference output voltage, as well as inconsistent temperature characteristics. Bandgap references with and without a proprietary stress-relief mechanism were compared to determine the impact of packaging stress on reference performance. References without stress-relief showed a mean offset of -2.3mV and spread of 10mV, while references with stress-relief showed a mean offset of -2.0mV and spread of 3.6mV. References with stress relief exhibited more consistent temperature coefficients than references without stress relief. A test chip was fabricated to allow measurement of VBE and AVBE within the bandgap reference. Parts with stress-relief showed tighter VBE and AVBE distributions, as well as more favorable temperature characteristics. The experiments in this thesis show that stress-relief is effective at improving bandgap reference performance. en_US
dc.description.statementofresponsibility by Ravi Palakodety. en_US
dc.format.extent 96 p. en_US
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582 en_US
dc.subject Electrical Engineering and Computer Science. en_US
dc.title Investigating packaging effects on bandgap references en_US
dc.type Thesis en_US
dc.description.degree M.Eng. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Electrical Engineering and Computer Science. en_US
dc.identifier.oclc 220914445 en_US


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