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Residual stress in nanocrystalline nickel tungsten electrodeposits

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dc.contributor.advisor Christopher A. Schuh. en_US
dc.contributor.author Ziebell, Tiffany D. (Tiffany Dawn) en_US
dc.contributor.other Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.date.accessioned 2012-03-16T16:04:14Z
dc.date.available 2012-03-16T16:04:14Z
dc.date.copyright 2011 en_US
dc.date.issued 2011 en_US
dc.identifier.uri http://hdl.handle.net/1721.1/69800
dc.description Thesis (S.M.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 2011. en_US
dc.description Cataloged from PDF version of thesis. en_US
dc.description Includes bibliographical references (p. 45-47). en_US
dc.description.abstract Characterizing the residual stress of thick nanocrystalline electrodeposits poses several unique challenges due to their fine grain structure, thickness distribution, and matte surface. We employ a three-dimensional profilometry-based approach that addresses each of these complicating factors and enables quantitative analysis of residual stress with reasonable accuracy. The specific emphasis of this work is thick (10-100 [mu]m), nanocrystalline Ni-W electrodeposits, in which residual stresses arise during the deposition process as well as during post-deposition annealing. The present measurements (for grain sizes ranging from 4-63 nm) offer quantitative insight into the mechanisms of stress development and evolution in these alloys, suggesting that the grain boundary structure is out of equilibrium (unrelaxed) and contains excess free volume, in and of itself acting as the primary source of residual stress in these coatings. We show that the amount of free volume initially created in the films can be predicted from the pulse amplitude of the current waveform employed during the deposition process while the corresponding grain size dictates the volume fraction of grain boundary area where this free volume can be accommodated - together, these processing and structure-based parameters control the resulting stress level in the film. en_US
dc.description.statementofresponsibility by Tiffany D. Ziebell. en_US
dc.format.extent 47 p. en_US
dc.language.iso eng en_US
dc.publisher Massachusetts Institute of Technology en_US
dc.rights M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. en_US
dc.rights.uri http://dspace.mit.edu/handle/1721.1/7582 en_US
dc.subject Materials Science and Engineering. en_US
dc.title Residual stress in nanocrystalline nickel tungsten electrodeposits en_US
dc.type Thesis en_US
dc.description.degree S.M. en_US
dc.contributor.department Massachusetts Institute of Technology. Dept. of Materials Science and Engineering. en_US
dc.identifier.oclc 777957224 en_US


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