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dc.contributor.advisorNeil A. Gershenfeld.en_US
dc.contributor.authorLangford, William Kaien_US
dc.contributor.otherMassachusetts Institute of Technology. Department of Architecture. Program in Media Arts and Sciences.en_US
dc.date.accessioned2015-02-25T17:13:42Z
dc.date.available2015-02-25T17:13:42Z
dc.date.copyright2014en_US
dc.date.issued2014en_US
dc.identifier.urihttp://hdl.handle.net/1721.1/95609
dc.descriptionThesis: S.M., Massachusetts Institute of Technology, School of Architecture and Planning, Program in Media Arts and Sciences, 2014.en_US
dc.descriptionCataloged from PDF version of thesis.en_US
dc.descriptionIncludes bibliographical references (pages 107-109).en_US
dc.description.abstractDigital materials are constructions assembled from a small number of types of discrete building blocks; they represent a new way of building functional, multi-material, three-dimensional structures. In this thesis, I focus on the construction of microelectronics from vertically assemble-able two-dimensional parts. With just a conducting and insulating part-type, I show that it is possible to make discretely assembled electrical networks. With a third resistive part-type, I show that it is possible to make any passive electronic component and complex impedance circuitry, including antennas and matching networks. Finally, with four semiconducting part-types I suggest that it is possible to assemble active components like diodes and transistors. This work details the part production processes to create two-dimensional micro-bricks, modeling and assembly strategies to create functional structures from discrete parts, the measurement and evaluation of the bulk properties of the assemblies, and experiments in assembly automation.en_US
dc.description.statementofresponsibilityby William Kai Langford.en_US
dc.format.extent109 pagesen_US
dc.language.isoengen_US
dc.publisherMassachusetts Institute of Technologyen_US
dc.rightsM.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission.en_US
dc.rights.urihttp://dspace.mit.edu/handle/1721.1/7582en_US
dc.subjectArchitecture. Program in Media Arts and Sciences.en_US
dc.titleElectronic digital materialsen_US
dc.typeThesisen_US
dc.description.degreeS.M.en_US
dc.contributor.departmentProgram in Media Arts and Sciences (Massachusetts Institute of Technology)
dc.identifier.oclc903903983en_US


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